Maximum ratings, Thermal characteristics, Electrical characteristics – Diodes DMG9N65CTI User Manual

Page 2: Dmg9n65cti

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DMG9N65CTI

Document number: DS36027 Rev. 3 - 2

2 of 5

www.diodes.com

January 2013

© Diodes Incorporated

DMG9N65CTI




Maximum Ratings

(@T

A

= +25°C, unless otherwise specified.)

Characteristic

Symbol

Value

Unit

Drain-Source Voltage

V

DSS

650 V

Gate-Source Voltage

V

GSS

±30 V

Continuous Drain Current (Notes 5 & 6)
V

GS

= 10V

Steady

State

T

C

= +25°C

T

C

= +70°C

I

D

9.0
7.0

A

Pulsed Drain Current (Note 7)

I

DM

30 A

Avalanche Current (Note 8) V

DD

= 100V, V

GS

= 10V, L = 60mH

I

AR

2.7 A

Repetitive avalanche energy (Note 8) V

DD

= 100V, V

GS

= 10V, L = 60mH

E

AR

260 mJ




Thermal Characteristics

Characteristic Symbol

Max

Unit

Power Dissipation (Note 5)

T

C

= +25°C

T

C

= +70°C

P

D

13

8

W

Thermal Resistance, Junction to Case (Note 5)

T

C

= +25°C

R

θJC

8.84

°C/W

Operating and Storage Temperature Range

T

J

,

T

STG

-55 to +150

°C




Electrical Characteristics

(@T

A

= +25°C, unless otherwise specified.)

Characteristic

Symbol

Min

Typ

Max

Unit

Test Condition

OFF CHARACTERISTICS (Note 9)
Drain-Source Breakdown Voltage

BV

DSS

650 - - V

V

GS

= 0V, I

D

= 250µA

Zero Gate Voltage Drain Current T

J

= +25°C

I

DSS

- - 1.0

µA

V

DS

= 650V, V

GS

= 0V

Gate-Source Leakage

I

GSS

- -

±100

nA

V

GS

= ±30V, V

DS

= 0V

ON CHARACTERISTICS (Note 9)
Gate Threshold Voltage

V

GS(th)

3 - 5 V

V

DS

= V

GS

, I

D

= 250μA

Static Drain-Source On-Resistance

R

DS (ON)

- 0.7 1.3 Ω

V

GS

= 10V, I

D

= 4.5A

Forward Transfer Admittance

|Y

fs

|

- 8.5 - S

V

DS

= 40V, I

D

= 4.5A

Diode Forward Voltage

V

SD

- 0.7 1.0 V

V

GS

= 0V, I

S

= 1A

DYNAMIC CHARACTERISTICS (Note 10)
Input Capacitance

C

iss

- 2310 -

pF

V

DS

= 25V, V

GS

= 0V,

f = 1.0MHz

Output Capacitance

C

oss

-

122

-

Reverse Transfer Capacitance

C

rss

-

2.2

-

Gate Resistance

R

g

-

2.2

-

V

DS

= 0V, V

GS

= 0V, f = 1MHz

Total Gate Charge V

GS

= 10V

Q

g

-

39

-

nC

V

GS

= 10V, V

DS

= 520V,

I

D

= 8A

Gate-Source Charge

Q

gs

-

8.5

-

Gate-Drain Charge

Q

gd

-

11.9

-

Turn-On Delay Time

t

D(on)

-

39

- ns

V

GS

= 10V, V

DS

= 325V,

R

G

= 25Ω, I

D

= 8A

Turn-On Rise Time

t

r

-

29

- ns

Turn-Off Delay Time

t

D(off)

-

122

- ns

Turn-Off Fall Time

t

f

-

28

- ns

Body Diode Reverse Recovery Time

t

rr

-

570

- ns

dI/dt = 100A/µs, V

DS

= 100V,

I

F

= 8A

Body Diode Reverse Recovery Charge

Q

rr

-

4.17

-

μC

Notes:

5. Device mounted on an infinite heatsink.
6. Drain current limited by maximum junction temperature.
7. Repetitive rating, pulse width limited by junction temperature.
8. I

AR

and E

AR

rating are based on low frequency and duty cycles to keep T

J

= +25°C.

9. Short duration pulse test used to minimize self-heating effect.
10. Guaranteed by design. Not subject to production testing.





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