Maximum ratings, Thermal characteristics, Electrical characteristics – Diodes DMN10H099SFG User Manual

Page 2

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POWERDI is a registered trademark of Diodes Incorporated

DMN10H1099SFG

Document number: DS36371 Rev. 2 - 2

2 of 6

www.diodes.com

January 2014

© Diodes Incorporated

DMN10H099SFG

ADVAN

CE I

N

F

O

RM

ATI

O

N




Maximum Ratings

(@T

A

= +25°C, unless otherwise specified.)

Characteristic Symbol

Value

Units

Drain-Source Voltage

V

DSS

100 V

Gate-Source Voltage

V

GSS

±20 V

Continuous Drain Current (Note 6) V

GS

= 10V

Steady

State

T

A

= +25°C

T

A

= +70°C

I

D

4.2
3.3

A

t<10s

T

A

= +25°C

T

A

= +70°C

I

D

5.8
4.5

A

Continuous Drain Current (Note 6) V

GS

= 6V

Steady

State

T

A

= +25°C

T

A

= +70°C

I

D

3.6
2.9

A

t<10s

T

A

= +25°C

T

A

= +70°C

I

D

5.2
4.1

A

Pulsed Drain Current (10μs pulse, duty cycle = 1%)

I

DM

20 A


Thermal Characteristics

(@T

A

= +25°C, unless otherwise specified.)

Characteristic Symbol

Value

Units

Total Power Dissipation (Note 5)

T

A

= +25°C

P

D

0.98

W

T

A

= +70°C

0.57

Thermal Resistance, Junction to Ambient (Note 5)

Steady state

R

JA

131

°C/W

t<10s 76

Total Power Dissipation (Note 6)

T

A

= +25°C

P

D

2.31

W

T

A

= +70°C

1.18

Thermal Resistance, Junction to Ambient (Note 6)

Steady state

R

θJA

55

°C/W

t<10s 28

Thermal Resistance, Junction to Case (Note 6)

R

θJC

6.9

Operating and Storage Temperature Range

T

J,

T

STG

-55 to +150

°C


Electrical Characteristics

(@T

A

= +25°C, unless otherwise specified.)

Characteristic

Symbol

Min

Typ

Max

Unit

Test Condition

OFF CHARACTERISTICS (Note 7)
Drain-Source Breakdown Voltage

BV

DSS

100 - - V

V

GS

= 0V, I

D

= 250μA

Zero Gate Voltage Drain Current

I

DSS

- - 1.0

μA

V

DS

= 80V, V

GS

= 0V

Gate-Source Leakage

I

GSS

- -

±100

nA

V

GS

= ±20V, V

DS

= 0V

ON CHARACTERISTICS (Note 7)
Gate Threshold Voltage

V

GS(th)

1.5 2.0 3.0 V

V

DS

= V

GS

, I

D

= 250μA

Static Drain-Source On-Resistance

R

DS (ON)

- 54 80

mΩ

V

GS

= 10V, I

D

= 3.3A

- 58 99

V

GS

= 6.0V, I

D

= 3.0A

Forward Transfer Admittance

|Y

fs

|

- 13 - S

V

DS

= 10V, I

D

= 3.3A

Diode Forward Voltage

V

SD

- 0.77 - V

V

GS

= 0V, I

S

= 3.2A

DYNAMIC CHARACTERISTICS (Note 8)
Input Capacitance

C

iss

- 1172 - pF

V

DS

= 50V, V

GS

= 0V,

f = 1.0MHz

Output Capacitance

C

oss

- 40.8 - pF

Reverse Transfer Capacitance

C

rss

- 31.3 - pF

Gate Resistance

R

g

- 1.6 - Ω

V

DS

= 0V, V

GS

= 0V, f = 1.0MHz

Total Gate Charge V

GS

= 10V

Q

g

- 25.2 - nC

V

DS

= 50V, I

D

= 3.3A

Total Gate Charge V

GS

= 4.5V

Q

g

- 12.2 - nC

Gate-Source Charge

Q

gs

- 5.3 - nC

Gate-Drain Charge

Q

gd

- 5.9 - nC

Turn-On Delay Time

t

D(on)

- 5.4 - ns

V

GS

= 10V, V

DS

= 50V,

R

G

= 6.0Ω, I

D

= 3.3A

Turn-On Rise Time

t

r

- 5.9 - ns

Turn-Off Delay Time

t

D(off)

- 20.0 - ns

Turn-Off Fall Time

t

f

- 7.3 - ns

Notes:

5. Device mounted on FR-4 substrate PC board, 2oz copper, with minimum recommended pad layout.
6. Device mounted on FR-4 substrate PC board, 2oz copper, with 1inch square copper plate.
7. Short duration pulse test used to minimize self-heating effect.
8. Guaranteed by design. Not subject to product testing.

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