Maximum ratings, Thermal characteristics, Electrical characteristics – Diodes DMP2004K User Manual

Page 2: Dmp2004k

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DMP2004K

Document number: DS30933 Rev. 7 - 2

2 of 5

www.diodes.com

July 2012

© Diodes Incorporated

DMP2004K






Maximum Ratings

(@T

A

= +25°C, unless otherwise specified.)

Characteristic Symbol

Value

Units

Drain-Source Voltage

V

DSS

-20 V

Gate-Source Voltage

V

GSS

±8 V

Continuous Drain Current (Note 5) V

GS

= -4.5V

I

D

-600 mA

Pulsed Drain Current

I

DM

-1.9 A


Thermal Characteristics

Characteristic Symbol

Value

Units

Total Power Dissipation (Note 5)

P

D

550 mW

Thermal Resistance, Junction to Ambient (Note 5)

R

θJA

227 °C/W

Operating and Storage Temperature Range

T

J,

T

STG

-55 to +150

°C


Electrical Characteristics

(@T

A

= +25°C, unless otherwise specified.)

Characteristic Symbol

Min

Typ

Max

Unit

Test

Condition

OFF CHARACTERISTICS (Note 6)
Drain-Source Breakdown Voltage

BV

DSS

-20 — — V

V

GS

= 0V, I

D

= -250µA

Zero Gate Voltage Drain Current

I

DSS

— — -1 µ

A

V

DS

= -20V, V

GS

= 0V

Gate-Source Leakage

I

GSS

— —

±1.0

µA

V

GS

= ±4.5V, V

DS

= 0V

ON CHARACTERISTICS (Note 6)
Gate Threshold Voltage

V

GS(th)

-0.5 — -1.0 V

V

DS

= V

GS

, I

D

= -250µA

Static Drain-Source On-Resistance

R

DS (ON)

— 0.7 0.9

V

GS

= -4.5V, I

D

= -430mA

— 1.1 1.4

V

GS

= -2.5V, I

D

= -300mA

— 1,7 2.0

V

GS

= -1.8V, I

D

= -150mA

Forward Transfer Admittance

|Y

fs

|

200 — — mS

V

DS

= -10V, I

D

= -0.2A

Diode Forward Voltage (Note 6)

V

SD

-0.5 — -1.2 V

V

GS

= 0V, I

S

= -115mA

DYNAMIC CHARACTERISTICS (Note 7)
Input Capacitance

C

iss

— — 175 pF

V

DS

= -16V, V

GS

= 0V

f = 1.0MHz

Output Capacitance

C

oss

— — 30 pF

Reverse Transfer Capacitance

C

rss

— — 20 pF

Turn-On Delay Time

t

D(on)

— 8.5 — ns

V

DD

= -3V, V

GS

= -2.5V,

R

L

= 300

Ω, R

G

= 25

Ω,

I

D

= -100mA

Turn-On Rise Time

t

r

— 4.3 — ns

Turn-Off Delay Time

t

D(off)

— 20.2 — ns

Turn-Off Fall Time

t

f

— 19.2 — ns

Notes:

5. Device mounted on FR-4 PCB.
6. Short duration pulse test used to minimize self-heating effect.
7. Guaranteed by design. Not subject to product testing.

























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