Maximum ratings, Thermal characteristics, Electrical characteristics – Diodes DMP2047UCB4 User Manual

Page 2

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DMP2047UCB4

Document number: DS36154 Rev. 5 - 2

2 of 6

www.diodes.com

October 2013

© Diodes Incorporated

DMP2047UCB4



Maximum Ratings

(@T

A

= +25°C, unless otherwise specified.)

Characteristic

Symbol

Value

Unit

Drain-Source Voltage

V

DSS

-20 V

Gate-Source Voltage

V

GSS

-6 V

Continuous Drain Current (Note 5) V

GS

= -4.5V

Steady

State

T

A

= +25°C

T

A

= +70°C

I

D

-4.1
-3.2

A

Continuous Drain Current (Note 5) V

GS

= -2.5V

Steady

State

T

A

= +25°C

T

A

= +70°C

I

D

-3.6
-2.8

A

Pulsed Drain Current (Note 6)

I

DM

16 A



Thermal Characteristics

Characteristic Symbol

Value Unit

Power Dissipation (Note 7)

P

D

1.0 W

Thermal Resistance, Junction to Ambient @ T

A

= +25°C (Note 7)

R

θJA

127 °C/W

Thermal Resistance, Junction to Case @ T

C

= +25°C (Note 7)

R

θJC

25.8 °C/W

Power Dissipation (Note 5)

P

D

1.66 W

Thermal Resistance, Junction to Ambient @ T

A

= +25°C (Note 5)

R

θJA

77 °C/W

Operating and Storage Temperature Range

T

J

,

T

STG

-55 to +150

°C



Electrical Characteristics

(@T

A

= +25°C, unless otherwise specified.)

Characteristic

Symbol

Min

Typ

Max

Unit

Test Condition

OFF CHARACTERISTICS (Note 8)
Drain-Source Breakdown Voltage

BV

DSS

-20

— V

V

GS

= 0V, I

D

= -250μA

Gate-Source Breakdown Voltage

BV

GSS

-6.0

— V

V

DS

= 0V, I

G

= -250μA

Zero Gate Voltage Drain Current T

J

= +25°C

I

DSS

— — -1

μA

V

DS

= -16V, V

GS

= 0V

Gate-Source Leakage

I

GSS

— — -100 nA

V

GS

= -6V, V

DS

= 0V

ON CHARACTERISTICS (Note 8)
Gate Threshold Voltage

V

GS(th)

-0.4 -0.8 -1.2 V

V

DS

= V

GS

, I

D

= -250μA

Static Drain-Source On-Resistance

R

DS(ON)

— — 47

mΩ

V

GS

= -4.5V, I

D

=-1A

— — 60

V

GS

= -2.5V, I

D

= -1A

Forward Transfer Admittance

|Y

fs

|

3.7 — S

V

DS

= -10V, I

D

= -1A

Diode Forward Voltage

V

SD

-0.7 -1.0 V

V

GS

= 0V, I

S

= -1A

Reverse Recovery Charge

Q

rr

— 3.07

nC

V

DD

= –10V, I

F

= –1A,

di/dt =100A/μs

Reverse Recovery Time

t

rr

— 13.14

ns

DYNAMIC CHARACTERISTICS (Note 9)
Input Capacitance

C

iss

218

pF

V

DS

= -10V, V

GS

= 0V,

f = 1.0MHz

Output Capacitance

C

oss

— 116

Reverse Transfer Capacitance

C

rss

— 11

Total Gate Charge

Q

g

— 2.3

nC

V

GS

= -4.5V, V

DS

= -10V,

I

D

= -1A

Gate-Source Charge

Q

gs

— 0.2

Gate-Drain Charge

Q

gd

— 0.4

Gate Charge at Vth

Q

g(th)

— 0.2

Turn-On Delay Time

t

D(on)

— 7.9

ns

V

DS

= -10V, V

GS

= -2.5V,

R

G

= 20Ω, I

D

= -1A

Turn-On Rise Time

t

r

— 10.7

Turn-Off Delay Time

t

D(off)

— 48

Turn-Off Fall Time

t

f

— 38

Notes:

5. Device mounted on FR4 material with 1-inch

2

(6.45-cm

2

), 2-oz. (0.071-mm thick) Cu.

6. Repetitive rating, pulse width limited by junction temperature.
7. Device mounted on FR-4 PCB with minimum recommended pad layout, single sided.
8. Short duration pulse test used to minimize self-heating effect.
9. Guaranteed by design. Not subject to production testing.

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