Dmg7401sfg new prod uc t, Maximum ratings, Thermal characteristics – Diodes DMG7401SFG User Manual

Page 2: Electrical characteristics, Dmg7401sfg

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POWERDI is a registered trademark of Diodes Incorporated

DMG7401SFG

Document number: DS35623 Rev. 10 - 2

2 of 6

www.diodes.com

June 2013

© Diodes Incorporated

DMG7401SFG

NEW PROD

UC

T


Maximum Ratings

(@T

A

= +25°C, unless otherwise specified.)

Characteristic Symbol

Value

Units

Drain-Source Voltage

V

DSS

-30 V

Gate-Source Voltage

V

GSS

±25 V

Continuous Drain Current (Note 6) V

GS

= -10V

Steady

State

T

A

= +25°C

T

A

= +70°C

I

D

-9.8
-7.7

A

t<10s

T

A

= +25°C

T

A

= +70°C

I

D

-13.5
-10.8

A

Maximum Continuous Body Diode Forward Current (Note 5)

I

S

-3.0 A

Pulsed Drain Current (10µs pulse, duty cycle = 1%)

I

DM

-80 A

Avalanche Current (Notes 7 & 8)

I

AR

14 A

Repetitive Avalanche Energy (Notes 7 & 8) L = 1mH

E

AR

104 mJ

Thermal Characteristics

(@T

A

= +25°C, unless otherwise specified.)

Characteristic Symbol

Value

Units

Total Power Dissipation (Note 5)

T

A

= +25°C

P

D

0.94

W

T

A

= +70°C

0.6

Thermal Resistance, Junction to Ambient (Note 5)

Steady State

R

θJA

137 °C/W

t<10s 82

°C/W

Total Power Dissipation (Note 6)

T

A

= +25°C

P

D

2.2

W

T

A

= +70°C

1.3

Thermal Resistance, Junction to Ambient (Note 6)

Steady State

R

θJA

60 °C/W

t<10s 36

°C/W

Thermal Resistance, Junction to Case (Note 6)

R

θJC

3.0 °C/W

Operating and Storage Temperature Range

T

J,

T

STG

-55 to +150

°C

Electrical Characteristics

(@T

A

= +25°C, unless otherwise specified.)

Characteristic

Symbol

Min

Typ

Max

Unit

Test Condition

OFF CHARACTERISTICS (Note 8)
Drain-Source Breakdown Voltage

BV

DSS

-30

— V

V

GS

= 0V, I

D

= -250

μA

Zero Gate Voltage Drain Current

I

DSS

-1

μA

V

DS

= -30V, V

GS

= 0V

Gate-Source Leakage

I

GSS

±10

μA

V

GS

= ±20V, V

DS

= 0V

ON CHARACTERISTICS (Note 8)
Gate Threshold Voltage

V

GS(th)

-1.7 — -3.0 V

V

DS

= V

GS

, I

D

= -250

μA

Static Drain-Source On-Resistance

R

DS (ON)

9 11

m

V

GS

= -20V, I

D

= -12A

10 13

V

GS

= -10V, I

D

= -9A

17 25

V

GS

= -4.5V, I

D

= -5A

Forward Transfer Admittance

|Y

fs

|

21 — S

V

DS

= -5V, I

D

= -10A

DYNAMIC CHARACTERISTICS (Note 9)
Input Capacitance

C

iss

2246 2987 pF

V

DS

= -15V, V

GS

= 0V,

f = 1.0MHz

Output Capacitance

C

oss

352 468 pF

Reverse Transfer Capacitance

C

rss

294 391 pF

Gate resistance

R

g

5.1 8.5

V

DS

= 0V, V

GS

= 0V, f = 1.0MHz

Total Gate Charge (V

GS

= 4.5V)

Q

g

20.5 30 nC

V

DS

= -15V, I

D

= -12A

Total Gate Charge (V

GS

= 10V)

Q

g

41 58 nC

Gate-Source Charge

Q

gs

7.6 - nC

Gate-Drain Charge

Q

gd

8.0 - nC

Turn-On Delay Time

t

D(on)

11.3 23 ns

V

DD

= -15V, V

GS

= -10V,

R

L

= 1.25

Ω, R

G

= 3

Ω,

Turn-On Rise Time

t

r

15.4 31 ns

Turn-Off Delay Time

t

D(off)

38.0 61 ns

Turn-Off Fall Time

t

f

22.0 38 ns

BODY DIODE CHARACTERISTICS
Diode Forward Voltage

V

SD

-0.7 -1.0 V V

GS

= 0V, I

S

= -1A

Reverse Recovery Time (Note 9)

t

rr

20 31 ns

I

S

= -9.5A, dI/dt = 100A/

μs

Reverse Recovery Charge (Note 9)

Q

rr

9.5 18 nC

Notes:

5. Device mounted on FR-4 substrate PC board, 2oz copper, with minimum recommended pad layout.
6. Device mounted on FR-4 substrate PC board, 2oz copper, with 1inch square copper plate.
7. I

AR

and E

AR

rating are based on low frequency and duty cycles to keep T

J

= +25°C

8. Short duration pulse test used to minimize self-heating effect
9. Guaranteed by design. Not subject to product testing

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