Maximum ratings, Thermal characteristics, Electrical characteristics – Diodes DMP3010LPSQ User Manual

Page 2: Dmp3010lpsq

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POWERDI is a registered trademark of Diodes Incorporated.

DMP3010LPSQ

Document number: DS36683 Rev. 3 - 2

2 of 7

www.diodes.com

January 2014

© Diodes Incorporated

DMP3010LPSQ


Maximum Ratings

(@T

A

= +25°C, unless otherwise specified.)

Characteristic

Symbol

Value

Unit

Drain-Source Voltage

V

DSS

-30 V

Gate-Source Voltage

V

GSS

±20 V

Continuous Drain Current (Note 7) V

GS

= 10V

Steady

State

T

A

= +25°C

T

A

= +70°C

I

D

-36
-29

A

Continuous Drain Current (Note 7) V

GS

= 4.5V

Steady

State

T

A

= +25°C

T

A

= +70°C

I

D

-31
-25

A

Continuous Drain Current (Note 6) V

GS

= 10V

Steady

State

T

A

= +25°C

T

A

= +70°C

I

D

-14.5
-11.5

A

Pulsed Drain Current (Notes 6 & 9)

I

DM

-100 A

Avalanche Current (Notes 10 & 11)

I

AR

-17.5 A

Repetitive Avalanche Energy (Notes 10 & 11) L = 1mH

E

AR

153 mJ


Thermal Characteristics

Characteristic Symbol

Value

Unit

Power Dissipation (Note 6)

P

D

2.18 W

Thermal Resistance, Junction to Ambient @T

A

= +25°C (Note 6)

R

θJA

55 °C/W

Power Dissipation (Note 7)

P

D

14.37 W

Thermal Resistance, Junction to Ambient @T

A

= +25°C (Note 7)

R

θJA

8.7 °C/W

Power Dissipation (Notes 7 & 8)

P

D

58.7 W

Thermal Resistance, Junction to Case @T

C

= +25°C (Notes 7 & 8)

R

θJC

2.13 °C/W

Operating and Storage Temperature Range

T

J

, T

STG

-55 to +150

°C


Electrical Characteristics

(@T

A

= +25°C, unless otherwise specified.)

Characteristic

Symbol

Min

Typ

Max

Unit

Test Condition

OFF CHARACTERISTICS (Note 11)
Drain-Source Breakdown Voltage

BV

DSS

-30 — — V

V

GS

= 0V, I

D

= -250µA

Zero Gate Voltage Drain Current

I

DSS

— — -1

μA

V

DS

= -30V, V

GS

= 0V

Gate-Source Leakage

I

GSS

— —

±100 nA

V

GS

= ±20V, V

DS

= 0V

ON CHARACTERISTICS (Note 11)
Gate Threshold Voltage

V

GS(th)

-1.1 -1.6 -2.1 V

V

DS

= V

GS

, I

D

= -250µA

Static Drain-Source On-Resistance

R

DS(ON)

5.7 7.5

mΩ

V

GS

= -10V, I

D

= -10A

7.2 10

V

GS

= -4.5V, I

D

= -10A

Forward Transfer Admittance

|Y

fs

|

30 — S

V

DS

= -15V, I

D

= -10A

Diode Forward Voltage

V

SD

-0.65 -1 V

V

GS

= 0V, I

S

= -1A

DYNAMIC CHARACTERISTICS (Note 12)
Input Capacitance

C

iss

6234

pF

V

DS

= 15V, V

GS

= 0V,

f = 1MHz

Output Capacitance

C

oss

1500

pF

Reverse Transfer Capacitance

C

rss

774

pF

Gate Resistance

R

g

1.28

V

DS

= 0V, V

GS

= 0V, f = 1MHz

Total Gate Charge (V

GS

= -10V)

Q

g

126.2

nC

V

DS

= -15V, I

D

= -10A

Total Gate Charge (V

GS

= -4.5V)

Q

g

59.2

nC

V

DS

= -15V, V

GS

= -4.5V,

I

D

= -10A

Gate-Source Charge

Q

gs

16.1

nC

Gate-Drain Charge

Q

gd

15.7

nC

Turn-On Delay Time

t

D(on)

11.4

ns

V

DS

= -15V, V

GEN

= -10V,

R

G

= 6Ω, I

D

= -1A

Turn-On Rise Time

t

r

9.4

ns

Turn-Off Delay Time

t

D(off)

260.7

ns

Turn-Off Fall Time

t

f

99.3

ns

Notes:

6. Device mounted on FR-4 PCB with 1 inch square 2 oz. Copper, single sided.

7. Device mounted on FR-4 PCB with infinite heatsink.

8. R

θJC

is guaranteed by design while R

θCA

is determined by the user’s board design.

9. Repetitive rating, pulse width limited by junction temperature, 10

s pulse, duty cycle = 1%.

10.

I

AR

and E

AR

rating are based on low frequency and duty cycles to keep T

J

= +25°C.

11. Short duration pulse test used to minimize self-heating effect.
12. Guaranteed by design. Not subject to production testing.

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