Diodes DMP3056LSD - Manual (Page 2)

DMP3056LSD
Document number: DS31420 Rev. 7 - 2
2 of 5
www.diodes.com
January 2014
© Diodes Incorporated
DMP3056LSD
NEW PROD
UC
T
Maximum Ratings
(@T
A
= +25°C, unless otherwise specified.)
Characteristic Symbol Value Units
Drain-Source Voltage V
DSS
-30 V
Gate-Source Voltage V
GSS
±20 V
Drain Current (Note 5) Steady
State T
A
= +25°C
T
A
= +70°C
I
D
-6.9
-5.8
A
Pulsed Drain Current (Note 6) I
DM
-24 A
Thermal Characteristics
Characteristic Symbol Value Unit
Total Power Dissipation (Note 5) P
D
2.5 W
Thermal Resistance, Junction to Ambient (Note 5) R
θJA
50 °C/W
Operating and Storage Temperature Range T
J,
T
STG
-55 to +150 °C
Electrical Characteristics
(@T
A
= +25°C, unless otherwise specified.)
Characteristic Symbol Min Typ Max Unit Test Condition
OFF CHARACTERISTICS (Note 7)
Drain-Source Breakdown Voltage
BV
DSS
-30 ⎯ ⎯ V V
GS
= 0V, I
D
= -250µA
Zero Gate Voltage Drain Current I
DSS
⎯ ⎯ -1 µA V
DS
= -30V, V
GS
= 0V
Gate-Source Leakage I
GSS
⎯ ⎯
±100
±800
nA
V
GS
= ±20V, V
DS
= 0V
V
GS
= ±25V, V
DS
= 0V
ON CHARACTERISTICS (Note 7)
Gate Threshold Voltage
V
GS(th)
-1 -1.7 -2.1 V V
DS
= V
GS
, I
D
= -250 μA
Static Drain-Source On-Resistance R
DS (ON)
⎯
⎯
⎯
⎯
45
65
m Ω
V
GS
= -10V, I
D
= -6.0A
V
GS
= -4.5V, I
D
= -5.0A
Forward Transconductance g
fs
⎯ 8 ⎯ S V
DS
= -10V, I
D
= -5.3A
Diode Forward Voltage (Note 7) V
SD
-0.5 ⎯ -1.2 V V
GS
= 0V, I
S
= -1.7A
DYNAMIC CHARACTERISTICS
Input Capacitance
C
iss
⎯ 722 ⎯ pF
V
DS
= -25V, V
GS
= 0V
f = 1.0MHz
Output Capacitance C
oss
⎯ 114 ⎯ pF
Reverse Transfer Capacitance C
rss
⎯ 92 ⎯ pF
Gate Resistance R
G
⎯ 3.3 ⎯ Ω
V
DS
= 0V, V
GS
= 0V
f = 1.0MHz
SWITCHING CHARACTERISTICS
Total Gate Charge
Q
G
⎯ 6.8 ⎯ nC
V
DS
= -15V, V
GS
= -4.5V,
I
D
= -6A
Q
G
⎯ 13.7 ⎯
nC
V
DS
= -15V, V
GS
= -10V,
I
D
= -6A
Gate-Source Charge Q
GS
⎯ 1.6 ⎯
Gate-Drain Charge Q
GD
⎯ 4.2 ⎯
Turn-On Delay Time t
d(on)
⎯ 6.4 ⎯
ns
V
DS
= -15V, V
GS
= -10V,
I
D
= -1A, R
G
= 6.0 Ω
Rise Time t
r
⎯ 5.3 ⎯
Turn-Off Delay Time t
d(off)
⎯ 26.5 ⎯
Fall Time t
f
⎯ 14.7 ⎯
Notes: 5. Device mounted on 2 oz. 1” x 1” Copper pads on 2” x 2” FR-4 PCB.
6. Pulse
width ≤10μS, Duty Cycle ≤1%.
7. Short duration pulse test used to minimize self-heating effect.