Maximum ratings, Thermal characteristics, Electrical characteristics – Diodes DMP32D4SFB User Manual

Page 2

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DMP32D4SFB

Document number: DS36161 Rev. 2 - 2

2 of 6

www.diodes.com

March 2013

© Diodes Incorporated

DMP32D4SFB

ADVAN

CE I

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F

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RM

ATI

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NEW PROD

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Maximum Ratings

(@T

A

= +25°C, unless otherwise specified.)

Characteristic

Symbol

Value

Unit

Drain-Source Voltage

V

DSS

-30 V

Gate-Source Voltage

V

GSS

±20 V

Continuous Drain Current (Note 5) V

GS

= -10V

T

A

= +25°C

T

A

= +70°C

I

D

-400
-300

mA

Continuous Drain Current (Note 6) V

GS

= -10V

T

A

= +25°C

T

A

= +70°C

I

D

-500
-400

mA

Pulsed Drain Current (Note 5)

I

DM

-1 A

Maximum Body Diode continuous Current

I

S

-800 mA




Thermal Characteristics

(@T

A

= +25°C, unless otherwise specified.)

Characteristic Symbol

Value

Units

Total Power Dissipation

(Note 5)

P

D

0.5

W

(Note 6)

1.2

Thermal Resistance, Junction to Ambient

(Note 5)

R

JA

273

°C/W

(Note 6)

105

Operating and Storage Temperature Range

T

J,

T

STG

-55 to 150

°C




Electrical Characteristics

(@T

A

= +25°C, unless otherwise specified.)

Characteristic

Symbol

Min

Typ

Max

Unit

Test Condition

OFF CHARACTERISTICS (Note 7)
Drain-Source Breakdown Voltage

BV

DSS

-30 - - V

V

GS

= 0V, I

D

= -1mA

Zero Gate Voltage Drain Current T

J

= +25°C

I

DSS

- - -1 µA

V

DS

= -30V, V

GS

= 0V

Gate-Source Leakage

I

GSS

- -

±10

µA

V

GS

= ±16V, V

DS

= 0V

ON CHARACTERISTICS (Note 7)
Gate Threshold Voltage

V

GS(th)

-1.3 - -2.3 V

V

DS

= V

GS

, I

D

= -250μA

Static Drain-Source On-Resistance

R

DS (ON)

- -

2.4

V

GS

= -10V, I

D

= -200mA

4

V

GS

= -4.5V, I

D

= -200mA

16

V

GS

= -2.5V, I

D

= -10mA

Forward Transfer Admittance

|Y

fs

|

- 6 - S

V

DS

= -10V, I

D

= -400mA

Diode Forward Voltage

V

SD

- 0.8 1.2 V

V

GS

= 0V, I

S

= -300mA

DYNAMIC CHARACTERISTICS (Note 8)
Input Capacitance

C

iss

- 51 - pF

V

DS

= -15V, V

GS

= 0V,

f = 1.0MHz

Output Capacitance

C

oss

- 11 - pF

Reverse Transfer Capacitance

C

rss

- 9 - pF

Total Gate Charge

Q

g

- 0.6 - nC

V

GS

= -4.5V

V

DS

= -10V,

I

D

= -200mA

Total Gate Charge

Q

g

- 1.3 - nC

V

GS

= -10V

Gate-Source Charge

Q

gs

- 0.2 - nC

Gate-Drain Charge

Q

gd

- 0.2 - nC

Turn-On Delay Time

t

D(on)

- 3.6 - ns

V

DS

= -15V, I

D

= -500mA

V

GS

= -10V, R

G

= 1Ω

Turn-On Rise Time

t

r

- 8.5 - ns

Turn-Off Delay Time

t

D(off)

- 31.3 - ns

Turn-Off Fall Time

t

f

- 20.2 - ns

Notes:

5. Device mounted on FR-4 PC board, with minimum recommended pad layout, single sided.
6. Device mounted on FR-4 substrate PC board, 2oz copper, with 1inch square copper pad layout
7 .Short duration pulse test used to minimize self-heating effect.

8. Guaranteed by design. Not subject to production testing.





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