Dmp4015sps new prod uc t, Maximum ratings, Thermal characteristics – Diodes DMP4015SPS User Manual

Page 2: Electrical characteristics, Dmp4015sps

Advertising
background image

DMP4015SPS

Document number: DS35518 Rev. 9 - 2

2 of 6

www.diodes.com

November 2013

© Diodes Incorporated

DMP4015SPS

NEW PROD

UC

T

POWERDI is a registered trademark of Diodes Incorporated



Maximum Ratings

(@T

A

= +25°C, unless otherwise specified.)

Characteristic Symbol

Value

Units

Drain-Source Voltage

V

DSS

-40 V

Gate-Source Voltage

V

GSS

±25 V

Continuous Drain Current (Note 6) V

GS

= -10V

Steady

State

T

A

= +25°C

T

A

= +70°C

I

D

-8.5
-6.8

A

t<10s

T

A

= +25°C

T

A

= +70°C

I

D

-13.0
-10.5

A

Continuous Drain Current (Note 7) V

GS

= -10V

Steady

State

T

A

= +25°C

T

A

= +70°C

I

D

-11.0

-8.7

A

t<10s

T

A

= +25°C

T

A

= +70°C

I

D

-17.0
-13.5

A

Pulsed Drain Current (10μs pulse, duty cycle = 1%)

I

DM

-100 A

Maximum Body Diode Continuous Current (Note 7)

I

S

-3.5 A

Avalanche Current (Note 8)

I

AS

-22 A

Avalanche Energy (Note 8)

E

AS

242 mJ

Thermal Characteristics

(@T

A

= +25°C, unless otherwise specified.)

Characteristic Symbol

Value

Units

Total Power Dissipation (Note 6)

T

A

= +25°C

P

D

1.3

W

T

A

= +70°C

0.8

Thermal Resistance, Junction to Ambient (Note 6)

Steady state

R

θJA

96.4 °C/W

t<10s 40.6

°C/W

Total Power Dissipation (Note 7)

T

A

= +25°C

P

D

2.1

W

T

A

= +70°C

1.4

Thermal Resistance, Junction to Ambient (Note 7)

Steady state

R

θJA

55.0 °C/W

t<10s 24.0

°C/W

Thermal Resistance, Junction to Case (Note 7)

R

θJC

4.15 °C/W

Operating and Storage Temperature Range

T

J,

T

STG

-55 to +150

°C

Electrical Characteristics

(@T

A

= +25°C, unless otherwise specified.)

Characteristic Symbol

Min

Typ

Max

Unit

Test

Condition

OFF CHARACTERISTICS (Note 9)
Drain-Source Breakdown Voltage

BV

DSS

-40

V

V

GS

= 0V, I

D

= -250μA

Zero Gate Voltage Drain Current

I

DSS





-1

µA

V

DS

= -40V, V

GS

= 0V

Gate-Source Leakage

I

GSS

100

nA

V

GS

=

25V, V

DS

= 0V

ON CHARACTERISTICS (Note 9)
Gate Threshold Voltage

V

GS(th)

-1.5 -2.0 -2.5 V

V

DS

= V

GS

, I

D

= -250

A

Static Drain-Source On-Resistance

R

DS (ON)

7 11

mΩ

V

GS

= -10V, I

D

= -9.8A

9 15

V

GS

= -4.5V, I

D

= -9.8A

Forward Transfer Admittance

|Y

fs

|

26

S

V

DS

= -20V, I

D

= -9.8A

Diode Forward Voltage

V

SD

-0.7 -1.0 V

V

GS

= 0V, I

S

= -1A

DYNAMIC CHARACTERISTICS (Note 10)
Input Capacitance

C

iss

4234

pF

V

DS

= -20V, V

GS

= 0V

f = 1.0MHz

Output Capacitance

C

oss

1036

Reverse Transfer Capacitance

C

rss

526

Gate Resistance

R

G



7.77



V

DS

= 0V, V

GS

= 0V, f = 1.0MHz

Total Gate Charge

Q

g

47.5

nC

V

DS

= -20V, V

GS

= -5V

I

D

= -9.8A

Gate-Source Charge

Q

gs

14.2

Gate-Drain Charge

Q

gd

13.5

Turn-On Delay Time

t

D(on)

13.2

ns

V

GS

= -10V, V

DD

= -20V, R

G

= 6Ω,

I

D

= -1A, R

L

= 20Ω

Turn-On Rise Time

t

r

10.0

Turn-Off Delay Time

t

D(off)

302.7

Turn-Off Fall Time

t

f



137.9



Notes:

6. Device mounted on FR-4 PC board, with minimum recommended pad layout, single sided.
7. Device mounted on FR-4 substrate PC board, 2oz copper, with thermal bias to bottom layer 1inch square copper plate
8. UIS in production with L = 0.1mH, TJ = +25°C
9 .Short duration pulse test used to minimize self-heating effect.

10. Guaranteed by design. Not subject to production testing.

Advertising