Diodes DMP56D0UV - Manual (Page 2)

DMP56D0UV
Document number: DS36174 Rev. 2 - 2
2 of 5
www.diodes.com
June 2013
© Diodes Incorporated
DMP56D0UV
Maximum Ratings (@T
A
= +25°C, unless otherwise specified.)
Characteristic Symbol Value Units
Drain-Source Voltage V
DSS
-50 V
Gate-Source Voltage Continuous V
GSS
8 V
Drain Current (Note 5) Continuous I
D
-160 mA
Pulsed Drain Current (10µs pulse, duty cycle = 1%) I
DM
-700 mA
Thermal Characteristics (@T
A
= +25°C, unless otherwise specified.)
Characteristic Symbol Value Units
Total Power Dissipation (Note 5) P
D
400 mW
Thermal Resistance, Junction to Ambient (Note 5) R
JA
313 C/W
Operating and Storage Temperature Range T
J
, T
STG
-55 to +150 C
Electrical Characteristics (@T
A
= +25°C, unless otherwise specified.)
Characteristic Symbol Min Typ Max Unit Test Condition
OFF CHARACTERISTICS (Note 6)
Drain-Source Breakdown Voltage
BV
DSS
-50   V V
GS
= 0V, I
D
= -250µA
Zero Gate Voltage Drain Current I
DSS
  -10 µA V
DS
= -50V, V
GS
= 0V
Gate-Body Leakage I
GSS
  1 µA V
GS
= 8V, V
DS
= 0V
ON CHARACTERISTICS (Note 6)
Gate Threshold Voltage
V
GS(th)
-0.5  -1.2 V V
DS
= V
GS
, I
D
= -250µA
Static Drain-Source On-Resistance R
DS (ON)

 4.6
6.0 6
8
Ω
V
GS
= -4V, I
D
= -100mA
V
GS
= -2.5V, I
D
= -80mA
Forward Transfer Admittance Y
fs
 100   mS V
DS
= -5V, I
D
= -100mA
Diode Forward Voltage V
SD
  -1.2 V V
GS
= 0V, I
S
= -100mA
DYNAMIC CHARACTERISTICS (Note 7)
Input Capacitance
C
iss
 50.54  pF
V
DS
= -25V, V
GS
= 0V, f = 1.0MHz Output Capacitance C
oss
 3.49  pF
Reverse Transfer Capacitance C
rss
 2.42  pF
Gate Resistance R
G
 201  Ω V
DS
= 0V, V
GS
= 0V, f = 1.0MHz
Total Gate Charge V
GS
= 4.5V Q
g
 0.58  nC
V
GS
= -4V, V
DS
= -25V,
I
D
= -100mA
Gate-Source Charge Q
gs
 0.09  nC
Gate-Drain Charge Q
gd
 0.14  nC
Turn-On Delay Time t
D(on)
 4.46  nS
V
DD
= -30V , I
D
= -0.27A , V
GEN
= -4V
,
R
GEN
= 6Ω
Turn-On Rise Time t
r
 6.63  nS
Turn-Off Delay Time t
D(off)
 21.9  nS
Turn-Off Fall Time t
f
 15.0  nS
Notes: 5. Device mounted on FR-4 PC board, with minimum recommended pad layout, single sided.
6. Short duration pulse test used to minimize self-heating effect.
7. Guaranteed by design. Not subject to production testing.