Diodes DMC2004VK - Manual (Page 2)

DMC2004VK
Document number: DS30925 Rev. 6 - 2
2 of 8
www.diodes.com
January 2013
© Diodes Incorporated
DMC2004VK
Maximum Ratings N-CHANNEL – Q
1 (@T A
= +25°C, unless otherwise specified.)
Characteristic Symbol Value Unit
Drain Source Voltage V
DSS
20 V
Gate-Source Voltage V
GSS
±8 V
Drain Current (Note 5)
T
A
= +25°C
T
A
= +85°C
I
D
670
480
mA
Maximum Ratings P-CHANNEL – Q
2 (@T A
= +25°C, unless otherwise specified.)
Characteristic Symbol Value Unit
Drain Source Voltage V
DSS
-20 V
Gate-Source Voltage V
GSS
±8 V
Drain Current (Note 5)
T
A
= +25°C
T
A
= +85°C
I
D
-530
-380
mA
Thermal Characteristics
Characteristic Symbol Value Units
Total Power Dissipation (Note 5) P
D
0.45 W
Thermal Resistance, Junction to Ambient (Note 5)
Steady state
R
θJA
281 °C/W
t<10s 210 °C/W
Total Power Dissipation (Note 6) P
D
1 W
Thermal Resistance, Junction to Ambient (Note 6)
Steady state
R
θJA
129 °C/W
t<10s 97 °C/W
Operating and Storage Temperature Range T
J,
T
STG
-55 to +150 °C
Electrical Characteristics N-CHANNEL – Q
1 (@T
A
= +25°C, unless otherwise specified.)
Characteristic Symbol Min Typ Max Unit Test Condition
OFF CHARACTERISTICS (Note 7)
Drain-Source Breakdown Voltage
BV
DSS
20 ⎯ ⎯ V V
GS
= 0V, I
D
= 10µA
Zero Gate Voltage Drain Current I
DSS
⎯ ⎯ 1.0 µA V
DS
= 16V, V
GS
= 0V
Gate-Source Leakage I
GSS
⎯ ⎯ ± 1.0 µA V
GS
= ±4.5V, V
DS
= 0V
ON CHARACTERISTICS (Note 7)
Gate Threshold Voltage
V
GS(th)
0.5 ⎯ 1.0 V V
DS
= V
GS
, I
D
= 250µA
Static Drain-Source On-Resistance R
DS (ON)
⎯
⎯
⎯ 0.4
0.5
0.7 0.55
0.70
0.90
Ω
V
GS
= 4.5V, I
D
= 540mA
V
GS
= 2.5V, I
D
= 500mA
V
GS
= 1.8V, I
D
= 350mA
Forward Transfer Admittance (Note 8) |Y
fs
| 200 ⎯ ⎯ mS V
DS
=10V, I
D
= 0.2A
Diode Forward Voltage V
SD
0.5 ⎯ 1.2 V V
GS
= 0V, I
S
= 115mA
DYNAMIC CHARACTERISTICS
Input Capacitance
C
iss
⎯ ⎯ 150 pF
V
DS
= 16V, V
GS
= 0V
f = 1.0MHz
Output Capacitance C
oss
⎯ ⎯ 25 pF
Reverse Transfer Capacitance C
rss
⎯ ⎯ 20 pF
Notes: 5. Device mounted on FR-4 substrate PC board, 2oz copper, with minimum recommended pad layout.
6. Device mounted on FR-4 substrate PC board, 2oz copper, with 1inch square copper plate.
7. Short duration pulse test used to minimize self-heating effect.
8. Guaranteed by design. Not subject to product testing.