Dmc2700udm new prod uc t, Electrical characteristics n-channel – q, Electrical characteristics p-channel – q – Diodes DMC2700UDM User Manual

Page 3: Dmc2700udm, A product line of diodes incorporated

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DMC2700UDM

Datasheet Number: DS35360 Rev. 1 - 2

3 of 9

www.diodes.com

June 2011

© Diodes Incorporated

DMC2700UDM

NEW PROD

UC

T

A Product Line of

Diodes Incorporated






Electrical Characteristics N-CHANNEL – Q

1

@T

A

= 25°C unless otherwise specified

Characteristic Symbol

Min

Typ

Max

Unit

Test

Condition

OFF CHARACTERISTICS (Note 5)
Drain-Source Breakdown Voltage

BV

DSS

20

⎯

⎯

V

V

GS

= 0V, I

D

= 250

μA

Zero Gate Voltage Drain Current

I

DSS

⎯

⎯

100 nA

V

DS

= 20V, V

GS

= 0V

Gate-Source Leakage

I

GSS

⎯

⎯

± 1.0

μA

V

GS

= ±4.5V, V

DS

= 0V

ON CHARACTERISTICS (Note 5)
Gate Threshold Voltage

V

GS(th)

0.5

⎯

1.0 V

V

DS

= V

GS

, I

D

= 250

μA

Static Drain-Source On-Resistance

R

DS (ON)

⎯
⎯
⎯

0.3
0.4
0.5

0.4
0.5
0.7

Ω

V

GS

= 4.5V, I

D

= 600mA

V

GS

= 2.5V, I

D

= 500mA

V

GS

= 1.8V, I

D

= 350mA

Forward Transfer Admittance

|Y

fs

|

⎯

1.4

⎯

S

V

DS

=10V, I

D

= 400mA

Diode Forward Voltage (Note 5)

V

SD

⎯

0.7 1.2 V

V

GS

= 0V, I

S

= 150mA

DYNAMIC CHARACTERISTICS
Input Capacitance

C

iss

⎯

60.67

⎯

pF

V

DS

= 16V, V

GS

= 0V

f = 1.0MHz

Output Capacitance

C

oss

⎯

9.68

⎯

pF

Reverse Transfer Capacitance

C

rss

⎯

5.37

⎯

pF

Total Gate Charge

Q

g

⎯

736.6

⎯

pC

V

GS

= 4.5V, V

DS

= 10V,

I

D

= 250mA

Gate-Source Charge

Q

gs

⎯

93.6

⎯

Gate-Drain Charge

Q

gd

⎯

116.6

⎯

Turn-On Delay Time

t

d(on)

⎯

5.1

⎯

ns

V

DD

= 10V, V

GS

= 4.5V,

R

L

= 47

Ω, R

G

= 10

Ω,

I

D

= 200mA

Turn-On Rise Time

t

r

⎯

7.4

⎯

Turn-Off Delay Time

t

d(off)

⎯

26.7

⎯

Turn-Off Fall Time

t

f

⎯

12.3

⎯




Electrical Characteristics P-CHANNEL – Q

2

@T

A

= 25°C unless otherwise specified

Characteristic Symbol

Min

Typ

Max

Unit

Test

Condition

OFF CHARACTERISTICS (Note 5)
Drain-Source Breakdown Voltage

BV

DSS

-20

⎯

⎯

V

V

GS

= 0V, I

D

= -250

μA

Zero Gate Voltage Drain Current

I

DSS

⎯

⎯

-100 nA

V

DS

= -20V, V

GS

= 0V

Gate-Source Leakage

I

GSS

⎯

⎯

± 1.0

μA

V

GS

= ±4.5V, V

DS

= 0V

ON CHARACTERISTICS (Note 5)
Gate Threshold Voltage

V

GS(th)

-0.5

⎯

-1.0 V

V

DS

= V

GS

, I

D

= -250

μA

Static Drain-Source On-Resistance

R

DS (ON)

⎯

0.5
0.7
1.0

0.7
0.9
1.3

Ω

V

GS

= -4.5V, I

D

= -430mA

V

GS

= -2.5V, I

D

= -300mA

V

GS

= -1.8V, I

D

= -150mA

Forward Transfer Admittance

|Y

fs

|

⎯

-0.9

⎯

S

V

DS

=10V, I

D

= -250mA

Diode Forward Voltage (Note 5)

V

SD

⎯

-0.8 -1.2 V

V

GS

= 0V, I

S

= -150mA

DYNAMIC CHARACTERISTICS
Input Capacitance

C

iss

⎯

59.76

⎯

pF

V

DS

= -16V, V

GS

= 0V

f = 1.0MHz

Output Capacitance

C

oss

⎯

12.07

⎯

pF

Reverse Transfer Capacitance

C

rss

⎯

6.36

⎯

pF

Total Gate Charge

Q

g

⎯

622.4

⎯

pC

V

GS

= -4.5V, V

DS

= -10V,

I

D

= -250mA

Gate-Source Charge

Q

gs

⎯

100.3

⎯

Gate-Drain Charge

Q

gd

⎯

132.2

⎯

Turn-On Delay Time

t

d(on)

⎯

5.1

⎯

ns

V

DD

= -10V, V

GS

= -4.5V,

R

L

= 47

Ω, R

G

= 10

Ω,

I

D

= -200mA

Turn-On Rise Time

t

r

⎯

8.1

⎯

Turn-Off Delay Time

t

d(off)

⎯

28.4

⎯

Turn-Off Fall Time

t

f

⎯

20.7

⎯

Notes: 5. Short duration pulse test used to minimize self-heating effect.






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