Electrical characteristics, N-channel, P-channel – Diodes DMHC3025LSD User Manual

Page 3

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DMHC3025LSD

Document number: DS35821 Rev. 4 - 2

3 of 9

www.diodes.com

November 2013

© Diodes Incorporated

DMHC3025LSD

NEW PROD

UC

T

ADVAN

CE I

N

F

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RM

ATI

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Electrical Characteristics

N-CHANNEL

(@T

A

= +25°C, unless otherwise specified.)

Characteristic

Symbol

Min

Typ

Max

Unit

Test Condition

OFF CHARACTERISTICS (Note 6)
Drain-Source Breakdown Voltage

BV

DSS

30

—

— V

V

GS

= 0V, I

D

= 250μA

Zero Gate Voltage Drain Current

I

DSS

— — 0.5

μA

V

DS

= 30V, V

GS

= 0V

Gate-Source Leakage

I

GSS

— — ±1

μA

V

GS

= ±20V, V

DS

= 0V

ON CHARACTERISTICS (Note 6)
Gate Threshold Voltage

V

GS(th)

1 — 2 V

V

DS

= V

GS

, I

D

= 250μA

Static Drain-Source On-Resistance

R

DS (ON)

—

19 25

mΩ

V

GS

= 10V, I

D

= 5A

—

26 40

V

GS

= 4.5V, I

D

= 4A

Forward Transfer Admittance

|Y

fs

|

—

4 — S

V

DS

= 5V, I

D

= 5A

Diode Forward Voltage

V

SD

—

0.70 1.2 V V

GS

= 0V, I

S

= 1.7A

DYNAMIC CHARACTERISTICS (Note 7)
Input Capacitance

C

iss

—

590

—

pF

V

DS

= 15V, V

GS

= 0V,

f = 1MHz

Output Capacitance

C

oss

—

122

—

Reverse Transfer Capacitance

C

rss

—

58

—

Gate resistance

R

g

—

1.5

—

Ω

V

DS

= 0V, V

GS

= 0V, f = 1MHz

Total Gate Charge (V

GS

= 4.5V)

Q

g

—

5.4

—

nC

V

DS

= 15V, I

D

= 7.8A

Total Gate Charge (V

GS

= 10V)

Q

g

—

11.7

—

Gate-Source Charge

Q

gs

—

1.8

—

Gate-Drain Charge

Q

gd

—

2.1

—

Turn-On Delay Time

t

D(on)

—

11.2

—

ns

V

DD

= 15V, V

GS

= 4.5V,

R

L

= 2.4Ω, R

G

= 1Ω,

Turn-On Rise Time

t

r

—

15

—

Turn-Off Delay Time

t

D(off)

—

17.5

—

Turn-Off Fall Time

t

f

—

8.7

—

Reverse Recovery Time

t

rr

—

18.3

—

ns

I

F

= 12A, di/dt = 500A/μs

Reverse Recovery Charge

Q

rr

—

12

—

nC

Electrical Characteristics

P-CHANNEL

(@T

A

= +25°C, unless otherwise specified.)

Characteristic

Symbol

Min

Typ

Max

Unit

Test Condition

OFF CHARACTERISTICS (Note 6)
Drain-Source Breakdown Voltage

BV

DSS

-30

— — V

V

GS

= 0V, I

D

= -250μA

Zero Gate Voltage Drain Current

I

DSS

— — -0.5

μA

V

DS

= -30V, V

GS

= 0V

Gate-Source Leakage

I

GSS

— — ±1

μA

V

GS

= ±20V, V

DS

= 0V

ON CHARACTERISTICS (Note 6)
Gate Threshold Voltage

V

GS(th)

-1 — -2 V

V

DS

= V

GS

, I

D

= -250μA

Static Drain-Source On-Resistance

R

DS (ON)

—

43 50

mΩ

V

GS

= -10V, I

D

= -5A

—

68 80

V

GS

= -4.5V, I

D

= -4A

Forward Transfer Admittance

|Y

fs

|

—

3.5 — S

V

DS

= -5V, I

D

= -5A

Diode Forward Voltage

V

SD

—

-0.7 -1.2 V V

GS

= 0V, I

S

= -1.7A

DYNAMIC CHARACTERISTICS (Note 7)
Input Capacitance

C

iss

—

631

—

pF

V

DS

= -15V, V

GS

= 0V,

f = 1MHz

Output Capacitance

C

oss

—

137

—

pF

Reverse Transfer Capacitance

C

rss

—

70

—

pF

Gate resistance

R

g

—

10.8

—

Ω

V

DS

= 0V, V

GS

= 0V, f = 1MHz

Total Gate Charge (V

GS

= 4.5V)

Q

g

—

5.5

—

nC

V

DS

= -15V, I

D

= -6A

Total Gate Charge (V

GS

= 10V)

Q

g

—

11.4

—

nC

Gate-Source Charge

Q

gs

—

1.8

—

nC

Gate-Drain Charge

Q

gd

—

2.4

—

nC

Turn-On Delay Time

t

D(on)

—

7.5

—

ns

V

DD

= -15V, V

GS

= -10V,

R

G

= 6Ω, I

D

= -1A

Turn-On Rise Time

t

r

—

4.9

—

ns

Turn-Off Delay Time

t

D(off)

—

28.2

—

ns

Turn-Off Fall Time

t

f

—

13.5

—

ns

Reverse Recovery Time

t

rr

—

15.1

—

ns

I

F

= 12A, di/dt = 500A/μs

Reverse Recovery Charge

Q

rr

—

15.3

—

nC

Notes:

6. Short duration pulse test used to minimize self-heating effect.
7. Guaranteed by design. Not subject to product testing.



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