Electrical characteristics, N-channel, P-channel – Diodes DMHC4035LSD User Manual

Page 3

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DMHC4035LSD

Document number: DS36287 Rev. 1 - 2

3 of 9

www.diodes.com

January 2014

© Diodes Incorporated

DMHC4035LSD

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Electrical Characteristics

N-CHANNEL

(@T

A

= +25°C, unless otherwise specified.)

Characteristic

Symbol

Min

Typ

Max

Unit

Test Condition

OFF CHARACTERISTICS (Note 6)
Drain-Source Breakdown Voltage

BV

DSS

40

—

—

V

V

GS

= 0V, I

D

= 250μA

Zero Gate Voltage Drain Current

I

DSS

—

—

1

μA

V

DS

= 40V, V

GS

= 0V

Gate-Source Leakage

I

GSS

—

—

±100 nA

V

GS

= ±20V, V

DS

= 0V

ON CHARACTERISTICS (Note 6)
Gate Threshold Voltage

V

GS(th)

1 — 3 V

V

DS

= V

GS

, I

D

= 250μA

Static Drain-Source On-Resistance

R

DS (ON)

—

26 45

mΩ

V

GS

= 10V, I

D

= 3.9A

—

35 58

V

GS

= 4.5V, I

D

= 3.5A

Diode Forward Voltage

V

SD

—

0.7 1 V

V

GS

= 0V, I

S

= 1.25A

DYNAMIC CHARACTERISTICS (Note 7)
Input Capacitance

C

iss

— 574 —

pF

V

DS

= 20V, V

GS

= 0V,

f = 1MHz

Output Capacitance

C

oss

—

87.8

—

Reverse Transfer Capacitance

C

rss

—

38.7

—

Gate resistance

R

g

—

1.6

—

Ω

V

DS

= 0V, V

GS

= 0V, f = 1MHz

Total Gate Charge (V

GS

= 4.5V)

Q

g

—

5.9

—

nC

V

DS

= 20V, I

D

= 3.9A

Total Gate Charge (V

GS

= 10V)

Q

g

—

12.5

—

Gate-Source Charge

Q

gs

—

1.7

—

Gate-Drain Charge

Q

gd

—

2.2

—

Turn-On Delay Time

t

D(on)

—

3.1

—

ns

V

DD

= 20V, V

GS

= 10V,

R

L

= 20Ω, R

G

= 6Ω,

Turn-On Rise Time

t

r

—

2.6

—

Turn-Off Delay Time

t

D(off)

—

15

—

Turn-Off Fall Time

t

f

—

5.5

—

Reverse Recovery Time

t

rr

—

6.5

—

ns

I

F

= 3.9A, di/dt = 500A/μs

Reverse Recovery Charge

Q

rr

—

1.2

—

nC

Electrical Characteristics

P-CHANNEL

(@T

A

= +25°C, unless otherwise specified.)

Characteristic

Symbol

Min

Typ

Max

Unit

Test Condition

OFF CHARACTERISTICS (Note 6)
Drain-Source Breakdown Voltage

BV

DSS

-40

—

— V

V

GS

= 0V, I

D

= -250μA

Zero Gate Voltage Drain Current

I

DSS

—

—

-1

μA

V

DS

= -40V, V

GS

= 0V

Gate-Source Leakage

I

GSS

—

—

±100 nA

V

GS

= ±20V, V

DS

= 0V

ON CHARACTERISTICS (Note 6)
Gate Threshold Voltage

V

GS(th)

-1 — -3 V

V

DS

= V

GS

, I

D

= -250μA

Static Drain-Source On-Resistance

R

DS (ON)

—

49 65

mΩ

V

GS

= -10V, I

D

= -4.2A

—

73 100

V

GS

= -4.5V, I

D

= -3.3A

Diode Forward Voltage

V

SD

—

-0.7 -1.2 V

V

GS

= 0V, I

S

= -1A

DYNAMIC CHARACTERISTICS (Note 7)
Input Capacitance

C

iss

—

587

—

pF

V

DS

= -20V, V

GS

= 0V,

f = 1MHz

Output Capacitance

C

oss

—

88.1

—

pF

Reverse Transfer Capacitance

C

rss

—

40.2

—

pF

Gate resistance

R

g

—

12.3

—

Ω

V

DS

= 0V, V

GS

= 0V, f = 1MHz

Total Gate Charge (V

GS

= -4.5V)

Q

g

—

5.4

—

nC

V

DS

= -20V, I

D

= -4.2A

Total Gate Charge (V

GS

= -10V)

Q

g

—

11.1

—

nC

Gate-Source Charge

Q

gs

—

1.5

—

nC

Gate-Drain Charge

Q

gd

—

2

—

nC

Turn-On Delay Time

t

D(on)

—

3.6

—

ns

V

DD

= -15V, V

GS

= -10V,

R

G

= 6Ω, I

D

= -1A

Turn-On Rise Time

t

r

—

2.9

—

ns

Turn-Off Delay Time

t

D(off)

—

36.3

—

ns

Turn-Off Fall Time

t

f

—

15.3

—

ns

Reverse Recovery Time

t

rr

—

15.5

—

ns

I

F

= -4.2A, di/dt = 500A/μs

Reverse Recovery Charge

Q

rr

—

16.9

—

nC

Notes:

6. Short duration pulse test used to minimize self-heating effect.

7. Guaranteed by design. Not subject to product testing.

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