Maximum ratings – q1, Maximum ratings – q2, Thermal characteristics – Diodes DMS3019SSD User Manual

Page 2: Dms3019ssd

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DMS3019SSD

Document number: DS35053 Rev. 2 - 2

2 of 10

www.diodes.com

October 2010

© Diodes Incorporated

DMS3019SSD




Maximum Ratings – Q1

@TA = 25°C unless otherwise specified

Characteristic

Symbol

Value

Unit

Drain-Source Voltage

V

DSS

30 V

Gate-Source Voltage

V

GSS

±12 V

Continuous Drain Current (Note 4) V

GS

= 10V

Steady

State

T

A

= 25°C

T

A

= 70°C

I

D

7.0
5.6

A

Continuous Drain Current (Note 5) V

GS

= 10V

Steady

State

T

A

= 25°C

T

A

= 70°C

I

D

9.0
7.0

A

Continuous Drain Current (Note 5) V

GS

= 4.5V

Steady

State

T

A

= 25°C

T

A

= 70°C

I

D

8.0
6.5

A

Pulsed Drain Current (Note 6)

I

DM

40 A

Avalanche Current (Notes 6 & 7)

I

AR

13 A

Repetitive Avalanche Energy (Notes 6 & 7) L = 0.3mH

E

AR

25.4 mJ





Maximum Ratings – Q2

@TA = 25°C unless otherwise specified

Characteristic

Symbol

Value

Unit

Drain-Source Voltage

V

DSS

30 V

Gate-Source Voltage

V

GSS

±20 V

Continuous Drain Current (Note 4) V

GS

= 10V

Steady

State

T

A

= 25°C

T

A

= 70°C

I

D

5.7
4.6

A

Continuous Drain Current (Note 5) V

GS

= 10V

Steady

State

T

A

= 25°C

T

A

= 70°C

I

D

7.0
5.6

A

Continuous Drain Current (Note 5) V

GS

= 4.5V

Steady

State

T

A

= 25°C

T

A

= 70°C

I

D

6.0
4.7

A

Pulsed Drain Current (Note 6)

I

D

40 A

Avalanche Current (Notes 6 & 7)

I

AR

16 A

Repetitive Avalanche Energy (Notes 6 & 7) L = 0.1mH

E

AR

12.8 mJ





Thermal Characteristics

Characteristic Symbol

Value

Unit

Power Dissipation (Note 4)

P

D

1.19 W

Thermal Resistance, Junction to Ambient @T

A

= 25°C (Note 4)

R

θJA

107 °C/W

Power Dissipation (Note 5)

P

D

1.79 W

Thermal Resistance, Junction to Ambient @T

A

= 25°C (Note 5)

R

θJA

70 °C/W

Operating and Storage Temperature Range

T

J

,

T

STG

-55 to +150

°C

Notes:

4. Device mounted on FR-4 substrate PC board, with minimum recommended pad layout. The value in any given application depends on the user’s specific

board design. Device contains two active die running at equal power.

5. Device mounted on 1 inch x 1 inch FR4 PCB with high coverage of single sided 1oz copper, in still air conditions. Device contains two active die running
at equal power.
6. Repetitive rating, pulse width limited by junction temperature.
7. I

AR

and E

AR

rating are based on low frequency and duty cycles to keep T

J

= 25°C















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