Package outline dimensions, Suggested pad layout – Diodes DESD5V0S1BB User Manual
Page 3
Advertising
DESD5V0S1BB
Document number: DS35590 Rev. 5 - 2
3 of 4
March 2012
© Diodes Incorporated
DESD5V0S1BB
ADVAN
CE I
N
F
O
RM
ATI
O
N
0
50
25
50
75
100
125
150
P
EAK
P
U
LS
E
D
E
R
A
T
IN
G
%
O
F
P
EAK
PO
W
E
R O
R
CUR
RENT
T , AMBIENT TEMPERATURE (°C)
Fig. 3 Power Dissipation vs. Ambient Temperature
A
0
100
25
75
175 200
0.1
0
1
2
3
4
5
6
I
, L
EAK
A
G
E
C
U
R
R
EN
T
(n
A
)
R
V , REVERSE VOLTAGE (V)
R
Fig. 4 Typical Reverse Characteristics
1
10
100
1,000
T = -55°C
A
T = 25°C
A
T = 85°C
A
T = 125°C
A
T = 150°C
A
Package Outline Dimensions
Suggested Pad Layout
SOD523
Dim
Min
Max
A
0.25
0.35
B
0.70
0.90
C
1.50
1.70
H
1.10
1.30
K
0.55
0.65
L
0.10
0.30
M
0.10 0.12
All Dimensions in mm
Dimensions
Value (in mm)
Z
2.3
G
1.1
X
0.8
Y
0.6
C
1.7
Z
X
C
G
Y
H
C
A
B
K
M
L
Advertising