Diodes MMDT3946 - Manual

MMDT3946
Document number: DS30123 Rev. 11 - 2
1 of 6
www.diodes.com
October 2008
© Diodes Incorporated
MMDT3946
COMPLEMENTARY NPN / PNP SMALL SIGNAL SURFACE MOUNT TRANSISTOR
Features
•
Complementary Pair One 3904-Type NPN
One 3906-Type PNP
• Epitaxial Planar Die Construction
•
Ideal for Low Power Amplification and Switching
•
Ultra-Small Surface Mount Package
• Lead Free/RoHS Compliant (Note 3)
•
"Green" Device (Note 4 and 5)
Mechanical Data
•
Case: SOT-363
• Case Material: Molded Plastic, “Green” Molding Compound,
Note 5. UL Flammability Classification Rating 94V-0
• Moisture Sensitivity: Level 1 per J-STD-020D
• Terminals: Matte Tin Finish annealed over Alloy 42 leadframe
(Lead Free Plating) Solderable per MIL-STD-202, Method 208
• Terminal Connections: See Diagram
•
Marking Information: See Page 5
•
Ordering Information: See Page 5
• Weight: 0.006 grams (approximate)
C
2
B
1
E
1
E
2
B
2
C
1
E1, B1, C1 = PNP3906 Section
E2, B2, C2 = NPN3904 Section
Top View Device Schematic
Maximum Ratings, NPN 3904 Section
@T
A
= 25°C unless otherwise specified
Characteristic Symbol NPN 3904 Section Unit
Collector-Base Voltage V
CBO
60 V
Collector-Emitter Voltage V CEO
40 V
Emitter-Base Voltage V
EBO
6.0 V
Collector Current - Continuous (Note 1) I
C
200 mA
Maximum Ratings, PNP 3906 Section
@T A = 25°C unless otherwise specified
Characteristic Symbol PNP 3906 Section Unit
Collector-Base Voltage V
CBO
-40 V
Collector-Emitter Voltage V
CEO
-40 V
Emitter-Base Voltage V
EBO
-5.0 V
Collector Current - Continuous (Note 1) I
C
-200 mA
Thermal Characteristics , Total Device
Power Dissipation (Note 1, 2) P
D
200 mW
Thermal Resistance, Junction to Ambient (Note 1) R θJA 625 °C/W
Operating and Storage Temperature Range T J , T STG
-55 to +150 °C
Notes: 1. Device mounted on FR-4 PCB, 1 inch x 0.85 inch x 0.062 inch; pad layout as shown on Diodes Inc. suggested pad layout document AP02001, which
can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf.
2. Maximum combined dissipation.
3. No purposefully added lead.
4. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com/products/lead_free/index.php.
5. Product manufactured with Date Code UO (week 40, 2007) and newer are built with Green Molding Compound. Product manufactured prior to Date
Code UO are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants.