Diodes MJD340 - Manual

MJD340
Document number: DS31609 Rev. 2 - 2
1 of 4
www.diodes.com
December 2008
© Diodes Incorporated
MJD340
NEW PROD
UC
T
HIGH VOLTAGE NPN SURFACE MOUNT TRANSISTOR
Features
•
Epitaxial Planar Die Construction
• High
Collector-EmitterVoltage
•
Ideally Suited for Automated Assembly Processes
• Ideal for Power Switching or Amplification Applications
• Lead Free By Design/RoHS Compliant (Note 1)
• "Green" Device (Note 2)
Mechanical Data
• Case:
DPAK
•
Case Material: Molded Plastic, "Green" Molding Compound. UL
Flammability Classification Rating 94V-0
• Moisture Sensitivity: Level 1 per J-STD-020D
• Terminals: Finish — Matte Tin annealed over Copper Leadframe
(Lead Free Plating). Solderable per MIL-STD-202, Method 208
•
Marking Information: See Page 4
• Ordering Information: See Page 4
• Weight: 0.34 grams (approximate)
Maximum Ratings
@T
A
= 25°C unless otherwise specified
Characteristic Symbol Value Unit
Collector-Base Voltage V
CBO
300 V
Collector-Emitter Voltage V CEO
300 V
Emitter-Base Voltage V
EBO
3 V
Continuous Collector Current I
C
0.5 A
Peak Pulse Collector Current I
CM
0.75 A
Thermal Characteristics
Characteristic Symbol Value Unit
Power Dissipation @T
C
= 25°C P
D
15 W
Thermal Resistance, Junction to Case R θJC 8.33 °C/W
Power Dissipation @T A = 25°C (Note 3) P D
1.56 W
Thermal Resistance, Junction to Ambient R θJA 80 °C/W
Operating and Storage Temperature Range T
J
, T
STG
-55 to +150 °C
Electrical Characteristics
@T
A
= 25°C unless otherwise specified
Characteristic Symbol Min Typ Max Unit Test Condition
OFF CHARACTERISTICS (Note 4)
Collector-Emitter Sustaining Voltage
V
(SUS)CEO
300 ⎯ ⎯ V I
C
= 1mA, I
B
= 0
Collector Cutoff Current I
CBO
⎯ ⎯ 100
μA
V
CB
= 300V, I
E
= 0
Emitter Cutoff Current I
EBO
⎯ ⎯ 100 μA V
EB
= 3V, I
C
= 0
ON CHARACTERISTICS (Note 4)
DC Current Gain
h
FE
30 ⎯ 240 ⎯ V
CE
= 10V, I
C
= 50mA
Notes: 1. No purposefully added lead.
2. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com/products/lead_free/index.php.
3. Device mounted on FR-4 PCB with minimum recommended pad layout.
4. Measured under pulsed conditions. Pulse width = 300
μs. Duty cycle ≤2%.
Top View
Device Schematic
Pin Out Configuration
COLLECTOR
BASE
EMITTER
3
1
2 4
3
1
2,4
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