Mmst5551, Package outline dimensions, Suggested pad layout – Diodes MMST5551 User Manual
Page 4
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MMST5551
Document number: DS30173 Rev. 9 - 2
4 of 4
May 2014
© Diodes Incorporated
MMST5551
Package Outline Dimensions
rsion.
Suggested Pad Layout
e latest version.
Note:
For high voltage applications, the appropriate industry sector guidelines should be considered with regards to creepage and clearance distances between
device Terminals and PCB tracking.
SOT323
Dim Min Max Typ
A
0.25 0.40 0.30
B
1.15 1.35 1.30
C
2.00 2.20 2.10
D
- -
0.65
G
1.20 1.40 1.30
H
1.80 2.20 2.15
J
0.0 0.10 0.05
K
0.90 1.00 1.00
L
0.25 0.40 0.30
M
0.10 0.18 0.11
α
0° 8° -
All Dimensions in mm
Dimensions Value (in mm)
Z
2.8
X
0.7
Y 0.9
C 1.9
E 1.0
A
M
J
L
D
B C
H
K
G
X
E
Y
C
Z
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