Global Specialties GSPA-K2 User Manual

Model gspa-k2 surface mount to dip adapter kit, Prototyping adapters

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Set of eleven adapter boards

Array of convenient sizes with various
lead spacing available

Can be used with Global Specialties
Electronic Trainers, Premium and
Economy Prototyping Solderless
Breadboards

Ideal for service, prototype and
experimental and educational use

Small footprint. Approximately the same
size as DIP socket equivalent component

Individual boards available in high
quantities for production retrofits

Made in USA

Global Specialties Surface Mount
Adapter Kit, Model GSPA-K2 is a
collection of SOIC, SSOP and MSOP
to DIP Adapter Sockets, which allow
the user to solder popular pin-
configured surface mount integrated
circuits onto a platform that is easily
adaptable to solderless breadboards
or existing circuit layouts. Once the
surface mount IC is mounted to the
DIP adapter, it becomes re-usable in
prototyping applications, similar to
other through-hole ICs, saving time
and money.
The GSPA-K2 is perfect for
educational prototyping and
experiment applications, as well as
production retrofits and daughter board
configurations.

Use Model 2003 to:

Generate Sine, Triange &
Square waveforms

Great for Depot repair
service

Design Engineering

Production Test

Quality Control

Model GSPA-K2

Surface Mount to DIP

Adapter Kit

Features:

Innovative Training Solutions

www.globalspecialties.com

Use Model GDPA-K2 to:

Place SMT parts in an

easy-to-use DIP
format for prototyping

Get unlimited uses

from SMT parts for
use in solderless
breadboarding
applications

Assemble “daughter”

cards for printed
circuit board retrofits.
SMT adapter will fit
directly into previous
through-hole
footprint.

Learn SMT soldering

skills in classroom or
lab.

Decrease costs by

utilizing previously
hard-to-find through
hole components
readily available in
SMT format

Prototyping Adapters

Specifications

Set of eleven adapter boards
including:

SOIC to DIP

– 8 pins: 300 Mil Span – 2ea

SOIC to DIP

– 14 pins: 300 Mil Span – 1 ea

SOIC to DIP

– 18 pins: 300 Mil Span – 1 ea

SOIC to DIP

– 24 pins: 300 Mil Span – 1 ea

SOIC to DIP

– 28 pins: 600 Mil Span – 1 ea

SOIC to DIP

– 32 pins: 600 Mil Span – 1 ea

SSOP to DIP

– 8 pins: 300 Mil Span – 1 ea

MSOP to DIP

– 10 pins: 300 Mil Span – 1ea

SSOP to DIP

– 16 pins: 300 Mil Span – 1 ea

SSOP to DIP

– 28 pins: 300 Mil Span – 1 ea

G l o b a l S p e ci a l t i e s
2 2 8 2 0 S a v i R a n c h P a r k w a y
Y o r b a L i n d a , C A 9 2 8 8 7
1 - 8 0 0 - 5 7 2 - 1 0 2 8

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