2 features, Features – AMD Geode LX [email protected] User Manual

Page 12

Advertising
background image

12

AMD Geode™ LX Processors Data Book

Overview

33234H

1.2

Features

General Features

■

Functional blocks include:
— CPU Core
— GeodeLink™ Control Processor
— GeodeLink Interface Units
— GeodeLink Memory Controller
— Graphics Processor
— Display Controller
— Video Processor

– TFT Controller/Video Output Port

— Video Input Port
— GeodeLink PCI Bridge
— Security Block

■

0.13 micron process

■

Packaging:
— 481-Terminal BGU (Ball Grid Array Cavity Up) with

internal heatspreader

■

Single packaging option supports all features

■

Industrial temperature range available for the
LX [email protected] processor*

CPU Processor Features

■

x86/x87-compatible CPU core

■

Performance:
— Processor frequency: up to 600 MHz
— Dhrystone 2.1 MIPs: 150 to 450
— Fully pipelined FPU

■

Split I/D cache/TLB (Translation Look-aside Buffer):
— 64 KB I-cache/64 KB D-cache
— 128 KB L2 cache configurable as I-cache, D-cache,

or both

■

Efficient prefetch and branch prediction

■

Integrated FPU that supports the MMX™ and
AMD 3DNow!™ instruction sets

■

Fully pipelined single precision FPU hardware with
microcode support for higher precisions

GeodeLink™ Control Processor

■

JTAG interface:
— ATPG, Full Scan, BIST on all arrays
— 1149.1 Boundary Scan compliant

■

ICE (in-circuit emulator) interface

■

Reset and clock control

■

Designed for improved software debug methods and
performance analysis

■

Power Management:
— LX [email protected] processor* (Unterminated):

Total Dissipated Power (TDP) 5.1W,
2.6W typical @ 600 MHz max power

— LX [email protected] processor* (Unterminated):

Total Dissipated Power (TDP) 3.6W,
1.8W typical @ 500 MHz max power

— LX [email protected] processor* (Unterminated):

Total Dissipated Power (TDP) 3.1W,
1.3W typical @ 433 MHz max power

— LX [email protected] processor* (Unterminated):

Total Dissipated Power (TDP) 2.8W,
1.2W typical @ 366 MHz max power

— GeodeLink active hardware power management
— Hardware support for standard ACPI software power

management

— I/O companion SUSP/SUSPA power controls
— Lower power I/O
— Wakeup on SMI/INTR

■

Works in conjunction with the AMD Geode™ CS5536
(USB 2.0) or CS5535 (USB 1.1) companion device

GeodeLink™ Architecture

■

High bandwidth packetized uni-directional bus for
internal peripherals

■

Standardized protocol to allow variants of products to be
developed by adding or removing modules

■

GeodeLink Control Processor (GLCP) for diagnostics
and scan control

■

Dual GeodeLink Interface Units (GLIUs) for device inter-
connect

GeodeLink™ Memory Controller

■

Integrated memory controller for low latency to CPU and
on-chip peripherals

■

64-bit wide DDR SDRAM bus operating frequency:
— 200 MHz, 400 MT/S

■

Supports unbuffered DDR DIMMS using up to 2 GB
DRAM technology

■

Supports up to 2 DIMMS (16 devices max)

2D Graphics Processor

■

High performance 2D graphics controller

■

Alpha BLT

■

Windows

®

GDI

GUI acceleration:

— Hardware support for all Microsoft RDP codes

■

Command buffer interface for asynchronous BLTs

■

Second pattern channel support

■

Hardware screen rotation

*The AMD Geode LX [email protected] processor operates at 600 MHz, the AMD Geode LX [email protected] processor operates at 500 MHz, the
AMD Geode LX [email protected] processor operates at 433 MHz and the AMD Geode LX [email protected] processor operates at 366 MHz. Model
numbers reflect performance as described here:

http://www.amd.com/connectivitysolutions/geodelxbenchmark

.

Advertising
This manual is related to the following products: