AMD Turion 64 X2 User Manual

Advanced micro devices, Socket s1g1 processor specific features

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Advanced Micro Devices

AMD Turion™ 64 X2 Mobile
Technology Dual-Core Processor
Product Data Sheet

•

Compatible with Existing 32-Bit Code Base
–

Including support for SSE, SSE2, SSE3*, MMX™,
3DNow!™ technology, and legacy x86 instructions
*SSE3 supported by Rev. E and later processors

–

Runs existing operating systems and drivers

–

Local APIC on the chip

•

AMD64 Technology
–

AMD64 technology instruction set extensions

–

64-bit integer registers, 48-bit virtual addresses,
40-bit physical addresses

–

Eight additional 64-bit integer registers (16 total)

–

Eight additional 128-bit SSE registers (16 total)

•

Dual-Core Architecture
–

Discrete L1 and L2 cache structures for each core

•

Enhanced Virus Protection
–

No Execute (NX) bit in page-translation tables
specifies whether code can be executed from the
page

•

HyperTransport™ Technology to I/O Devices
–

One 16-bit link supporting speeds up to 800 MHz
(1600 MT/s) or 3.2 Gbytes/s in each direction

•

64-Kbyte 2-Way Associative ECC-Protected
L1 Data Cache
–

Two 64-bit operations per cycle, 3-cycle latency

•

64-Kbyte 2-Way Associative Parity-Protected
L1 Instruction Cache
–

With advanced branch prediction

•

16-Way Associative ECC-Protected
L2 Cache
–

Exclusive cache architecture—storage in addition
to L1 caches

–

Up to 1 Mbyte per L2 cache

–

1 Mbyte and 512-Kbyte options

•

Machine Check Architecture
–

Includes hardware scrubbing of major
ECC-protected arrays

Socket S1g1 Processor Specific
Features

•

Refer to the Socket S1g1 Processor Functional
Data Sheet
, order# 31731, for functional and
mechanical details of socket S1g1 processors.
Refer to the AMD NPT Family 0Fh Processor
Electrical Data Sheet
, order# 31119, for
electrical details of socket S1g1 processors.

•

Packaging
–

638-pin lidless micro PGA package

–

1.27-mm pin pitch

–

26 x 26 pin grid array

–

35 mm x 35 mm organic substrate

–

Compliant with RoHS (EU Directive 2002/95/EC)
with lead used only in small amounts in specifically
exempted applications

•

Integrated Memory Controller
–

Low-latency, high-bandwidth

–

128-bit DDR2 SDRAM controller operating at up
to 333 MHz

–

Supports up to two unbuffered SO-DIMMs

•

Electrical Interfaces
–

HyperTransport™ technology: LVDS-like
differential, unidirectional

–

DDR2 SDRAM: SSTL_1.8 per JEDEC
specification

–

Clock, reset, and test signals also use DDR2
SDRAM-like electrical specifications.

•

Power Management
–

Multiple low-power states including Deeper Sleep
(C1E with AltVID)

–

System Management Mode (SMM)

–

ACPI compliant, including support for processor
performance states

–

AMD PowerNow!™ technology is designed to
dynamically switch between multiple low-power
states based on application performance
requirements.

41407

Publication #

3.02

Revision:

September 2006

Issue Date:

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