AMD Turion 64 User Manual

Advanced micro devices, Pin package specific features

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Advanced Micro Devices

AMD Turion™ 64 Mobile Technology
Product Data Sheet

•

Compatible with Existing 32-Bit Code Base
–

Including support for SSE, SSE2, SSE3*, MMX™,
3DNow!™ technology, and legacy x86 instructions
*SSE3 supported by Rev. E and later processors

–

Runs existing operating systems and drivers

–

Local APIC on the chip

•

AMD64 Technology
–

AMD64 technology instruction set extensions

–

64-bit integer registers, 48-bit virtual addresses,
40-bit physical addresses

–

Eight additional 64-bit integer registers (16 total)

–

Eight additional 128-bit SSE registers (16 total)

•

Enhanced Virus Protection
–

No Execute (NX) bit in page-translation tables
specifies whether code can be executed from the
page

•

HyperTransport™ Technology to I/O Devices
–

One 16-bit link supporting speeds up to 800 MHz
(1600 MT/s) or 3.2 Gbytes/s in each direction

•

64-Kbyte 2-Way Associative ECC-Protected
L1 Data Cache
–

Two 64-bit operations per cycle, 3-cycle latency

•

64-Kbyte 2-Way Associative Parity-Protected
L1 Instruction Cache
–

With advanced branch prediction

•

16-Way Associative ECC-Protected
L2 Cache
–

Exclusive cache architecture—storage in addition
to L1 caches

–

Up to 1 Mbyte per L2 cache

–

1 Mbyte and 512-Kbyte options

•

Machine Check Architecture
–

Includes hardware scrubbing of major
ECC-protected arrays

754-Pin Package Specific Features

•

Refer to the AMD Functional Data Sheet,
754-Pin Package
, order# 31410, for functional,
mechanical, and electrical details of 754-pin
packages.

•

Packaging
–

754-pin lidless micro PGA

–

1.27-mm pin pitch

–

29 x 29-row pin array

–

40 mm x 40 mm organic substrate

–

Organic C4 die attach

•

Integrated Memory Controller
–

Low-latency, high-bandwidth

–

72-bit DDR SDRAM at 100, 133, 166, and 200 MHz

–

Supports up to two unbuffered SO-DIMMs

–

ECC checking with double-bit detect and single-bit
correct

•

Electrical Interfaces
–

HyperTransport™ technology: LVDS-like
differential, unidirectional

–

DDR SDRAM: SSTL_2 per JEDEC specification

–

Clock, reset, and test signals also use DDR
SDRAM-like electrical specifications.

•

Power Management
–

Multiple low-power states including Deeper Sleep
(C3 with AltVID)

–

System Management Mode (SMM)

–

ACPI compliant, including support for processor
performance states

–

AMD PowerNow!™ technology is designed to
dynamically switch between multiple low-power
states based on application performance
requirements.

32816

Publication #

3.05

Revision:

September 2006

Issue Date:

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