Document Outline

• HP ProLiant DL360 G7 Server User Guide
• Abstract
• Notice
• Contents
• Component identification
  • Front panel components
  • Front panel LEDs and buttons
  • Rear panel components
  • Rear panel LEDs and buttons
  • System board components
    • DIMM slots
    • System maintenance switch
    • NMI jumper
  • Systems Insight Display LEDs
  • Systems Insight Display LED combinations
  • SAS and SATA device numbers
  • SAS and SATA hard drive LEDs
  • Fan modules
  • T-10/T-15 Torx screwdriver
• Operations
  • Power up the server
  • Power down the server
  • Extend the server from the rack
  • Access the HP Systems Insight Display
  • Remove the access panel
  • Install the access panel
  • Remove the BBWC battery pack or the FBWC capacitor pack
  • Remove the air baffle
  • Install the air baffle
  • Remove the PCI riser board assembly
  • Install the PCI riser board assembly
• Setup
  • Optional installation services
  • Rack planning resources
  • Optimum environment
    • Space and airflow requirements
    • Temperature requirements
    • Power requirements
    • Electrical grounding requirements
  • Rack warnings
  • Contents of the server shipping carton
  • Installing hardware options
  • Installing the server into the rack
  • Powering up and configuring the server
  • Installing the operating system
  • Registering the server
• Hardware options installation
  • Introduction
  • Processor and fan module option
  • Memory options
    • Memory subsystem architecture
    • Single-, dual-, and quad-rank DIMMs
    • DIMM identification
    • Memory configurations
      • RDIMM maximum memory configurations
      • UDIMM maximum memory configurations
      • Advanced ECC memory configuration
      • Lockstep memory configuration
      • Online Spare memory configuration
      • Mirrored memory configuration
    • General DIMM slot population guidelines
      • Advanced ECC population guidelines
        • Single-processor Advanced ECC population order
        • Multi-processor Advanced ECC population order
      • Lockstep Memory population guidelines
        • Single-processor Lockstep population order
        • Multi-processor Lockstep population order
      • Online Spare population guidelines
        • Single-processor Online Spare population order
        • Multi-processor Online Spare population order
      • Mirrored Memory population guidelines
        • Single-processor Mirrored Memory population order
        • Multi-processor Mirrored Memory population order
    • Installing a DIMM
  • Hot-plug SAS and SATA hard drive options
    • Removing hard drive blanks
    • Removing hard drive bezel blanks
    • Removing the dual hard drive bezel blank
    • Removing a hot-plug SAS hard drive
    • Installing a SAS hard drive
  • DVD-ROM and DVD-RW drive option
  • Hard drive blackplane option
  • Controller options
    • Installing the cache module
    • Installing the BBWC battery pack or the FBWC capacitor pack
  • Expansion board options
    • Installing an expansion board
    • Installing a PCI-X riser board
  • PCI thermal - power option
  • Redundant hot-plug power supply option
  • HP Trusted Platform Module option
    • Installing the Trusted Platform Module board
    • Retaining the recovery key/password
    • Enabling the Trusted Platform Module
• Cabling
  • Cabling overview
  • Hard drive backplane cabling
  • BBWC battery pack or FBWC capacitor pack cabling
  • DVD-ROM and DVD-RW drive cabling
  • Power button and Systems Insight Display cabling
  • PCI power cabling
• Software and configuration utilities
  • Configuration tools
    • SmartStart software
      • SmartStart Scripting Toolkit
    • HP ROM-Based Setup Utility
      • Using RBSU
      • Auto-configuration process
      • Boot options
      • BIOS Serial Console
      • Configuring AMP modes
        • Configuring Advanced ECC memory
        • Configuring lockstep memory
        • Configuring online spare memory
        • Configuring mirrored memory
    • Array Configuration Utility
    • Option ROM Configuration for Arrays
    • Re-entering the server serial number and product ID
  • Management tools
    • Automatic Server Recovery
    • ROMPaq utility
    • Integrated Lights-Out 3 technology
    • Erase Utility
    • Redundant ROM support
      • Safety and security benefits
    • USB support
  • Diagnostic tools
    • HP Insight Diagnostics
    • HP Insight Diagnostics survey functionality
    • Integrated Management Log
  • Remote support and analysis tools
    • HP Insight Remote Support software
  • Keeping the system current
    • Drivers
    • Version control
    • ProLiant Support Packs
    • Operating System Version Support
    • Firmware
    • HP Smart Update Manager
    • Change control and proactive notification
    • Care Pack
• Troubleshooting
  • Troubleshooting resources
  • Pre-diagnostic steps
    • Important safety information
      • Symbols on equipment
      • Warnings and cautions
    • Symptom information
    • Prepare the server for diagnosis
      • Performing processor procedures in the troubleshooting process
      • Breaking the server down to the minimum hardware configuration
  • Loose connections
  • Service notifications
  • Server health LEDs
  • Troubleshooting flowcharts
    • Start diagnosis flowchart
    • General diagnosis flowchart
    • Server power-on problems flowchart
    • POST problems flowchart
    • OS boot problems flowchart
    • Server fault indications flowchart
  • POST error messages and beep codes
• System battery
• Regulatory compliance notices
  • Regulatory compliance identification numbers
  • Federal Communications Commission notice
    • FCC rating label
    • Class A equipment
    • Class B equipment
  • Declaration of conformity for products marked with the FCC logo, United States only
  • Modifications
  • Cables
  • Canadian notice (Avis Canadien)
  • European Union regulatory notice
  • Disposal of waste equipment by users in private households in the European Union
  • Japanese notice
  • BSMI notice
  • Korean notice
  • Chinese notice
  • Laser compliance
  • Battery replacement notice
  • Taiwan battery recycling notice
  • Power cord statement for Japan
  • Acoustics statement for Germany (Geräuschemission)
• Electrostatic discharge
  • Preventing electrostatic discharge
  • Grounding methods to prevent electrostatic discharge
• Specifications
  • Environmental specifications
  • Server specifications
  • Power supply specifications
    • HP 460 W CS HE Power Supply (92%) specifications
    • HP 460 W CS Platinum Power Supply (94%) specifications
    • HP 750 W CS HE Power Supply (92%) specifications
    • HP 750 W CS Platinum Power Supply (94%) specifications
    • HP 1200 W CS HE Power Supply (90%) specifications
    • HP 1200 W CS -48Vdc Power Supply specifications
  • Hot-plug power supply calculations
• Technical support
  • Before you contact HP
  • HP contact information
  • Customer Self Repair
• Acronyms and abbreviations
• Index