HP OneView for Red Hat Enterprise Virtualization User Manual

Page 20

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Output Power—The amount of power in Watts that the subsystem is producing.

•

Power Consumed—The current power consumed by the subsystem.

•

Good Power Supplies—The number of power supplies that are currently operating in the
subsystem.

•

Wanted Power Supplies—The needed number of power supplies plus the redundant number
of power supplies in the subsystem.

•

Needed Power Supplies—The number of power supplies needed for the subsystem to work
properly.

Thermal Information

The Thermal Information data table contains:

•

Redundancy—The status of thermal subsystem redundancy: either in a redundant configuration,
not in a redundant configuration, or status unknown.

•

Ambient Temperature—The temperature inside the enclosure.

•

Good Fans—The number of fans currently operating in the enclosure.

•

Wanted Fans—The needed number of fans plus the redundant number of fans.

•

Needed Fans—Number of fans required for the subsystem not to overheat.

Fan Information

The Fan Information table contains, for each fan bay:

•

Bay—The location of the fan.

•

Status—The current status of the fan.

•

Name—The HP product name of the fan.

•

Speed—Fan speed for thermal management of server.

•

Power—The amount of power currently being consumed by the fan.

•

Part Number—The HP fan part number.

•

Spare Part Number—The HP fan spare part number.

Power Supplies

The Power Supplies table contains, for each power supply bay:

•

Bay—The location of the power supply.

•

Status—The current status of the power supply.

•

Name—The HP product name of the power supply.

•

Power—The amount of power currently supplied and the total amount of power that can be
supplied.

•

Serial Number—The HP serial number for the power supply.

•

Part Number—The HP part number for the power supply.

•

Spare Part Number—The HP spare part number for the power supply.

Interconnect trays

The Interconnect Trays table contains, for each interconnect bay:

•

Bay—The number of the bay containing the interconnect tray.

•

Status—The current status of the enclosure tray.

•

Name—The HP product name of the interconnect module.

•

Power—The amount of power currently being used by the interconnect module.

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Viewing inventory, performance, and health data for HP ProLiant host servers

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