Cirrus Logic CS48LV13 - Manual (Page 24)

24 DS1057F1
6 Package Dimensions
6 Package Dimensions
Table 6-1. WLCSP Package Dimension
Symbol Description Dimensions
A Total thickness 0.495 ±0.04
S Wafer thickness 0.305 ±0.025
A1 Standoff 0.190 ±0.015
E Body size X 2
D Y 2.25
SE Ball/bump pitch X 0.2 BSC 1
SD Y — BSC
E1 Edge ball center-to-center X 1.2 BSC
D1 Y 1.6 BSC
e Pitch 0.4 BSC
Ball diameter 0.25
b Ball/bump width 0.216–0.324
n Ball/bump count 20
20-BALL WLCSP (2.25 mm x 2.0 mm Body) Package Drawing
A B C D
1
2
3
4
5