Maximum ratings, Operating range, Electrical characteristics – Cypress CY7C1380FV25 User Manual

Page 17

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CY7C1380DV25, CY7C1380FV25
CY7C1382DV25, CY7C1382FV25

Document #: 38-05546 Rev. *E

Page 17 of 29

Maximum Ratings

Exceeding the maximum ratings may impair the useful life of

the device. For user guidelines, not tested.
Storage Temperature ................................. –65

°C to +150°C

Ambient Temperature with

Power Applied............................................. –55

°C to +125°C

Supply Voltage on V

DD

Relative to GND ....... –0.3V to +3.6V

Supply Voltage on V

DDQ

Relative to GND ...... –0.3V to +V

DD

DC Voltage Applied to Outputs

in Tri-State........................................... –0.5V to V

DDQ

+ 0.5V

DC Input Voltage ................................... –0.5V to V

DD

+ 0.5V

Current into Outputs (LOW) ........................................ 20 mA
Static Discharge Voltage........................................... >2001V

(per MIL-STD-883, Method 3015)
Latch-up Current .................................................... >200 mA

Operating Range

Range

Ambient

Temperature

V

DD

/V

DDQ

Commercial

0°C to +70°C

2.5V ± 5%

Industrial

–40°C to +85°C

Electrical Characteristics

Over the Operating Range

[16, 17]

Parameter

Description

Test Conditions

Min.

Max.

Unit

V

DD

Power Supply Voltage

2.375

2.625

V

V

DDQ

IO Supply Voltage

for 2.5V IO

2.375

V

DD

V

V

OH

Output HIGH Voltage

for 2.5V IO, I

OH

=

−1.0 mA

2.0

V

V

OL

Output LOW Voltage

for 2.5V IO, I

OL

= 1.0 mA

0.4

V

V

IH

Input HIGH Voltage

[16]

for 2.5V IO

1.7

V

DD

+ 0.3V

V

V

IL

Input LOW Voltage

[16]

for 2.5V IO

–0.3

0.7

V

I

X

Input Leakage Current

except ZZ and MODE

GND

≤ V

I

≤ V

DDQ

–5

5

µA

Input Current of MODE Input = V

SS

–30

µA

Input = V

DD

5

µA

Input Current of ZZ

Input = V

SS

–5

µA

Input = V

DD

30

µA

I

OZ

Output Leakage Current GND

≤ V

I

≤ V

DD,

Output Disabled

–5

5

µA

I

DD

V

DD

Operating Supply

Current

V

DD

= Max., I

OUT

= 0 mA,

f = f

MAX

= 1/t

CYC

4.0-ns cycle, 250 MHz

350

mA

5.0-ns cycle, 200 MHz

300

mA

6.0-ns cycle, 167 MHz

275

mA

I

SB1

Automatic CE

Power Down

Current—TTL Inputs

V

DD

= Max, Device Deselected,

V

IN

≥ V

IH

or V

IN

≤ V

IL

f = f

MAX

= 1/t

CYC

4.0-ns cycle, 250 MHz

160

mA

5.0-ns cycle, 200 MHz

150

mA

6.0-ns cycle, 167 MHz

140

mA

I

SB2

Automatic CE

Power Down

Current—CMOS Inputs

V

DD

= Max, Device Deselected,

V

IN

≤ 0.3V or V

IN

> V

DDQ

– 0.3V,

f = 0

All speeds

70

mA

I

SB3

Automatic CE

Power Down

Current—CMOS Inputs

V

DD

= Max, Device Deselected, or

V

IN

≤ 0.3V or V

IN

> V

DDQ

– 0.3V

f = f

MAX

= 1/t

CYC

4.0-ns cycle, 250 MHz

135

mA

5.0-ns cycle, 200 MHz

130

mA

6.0-ns cycle, 167 MHz

125

mA

I

SB4

Automatic CE

Power Down

Current—TTL Inputs

V

DD

= Max, Device Deselected,

V

IN

≥ V

IH

or V

IN

≤ V

IL

, f = 0

All speeds

80

mA

Notes:

16. Overshoot: V

IH

(AC) < V

DD

+1.5V (pulse width less than t

CYC

/2), undershoot: V

IL

(AC) > –2V (pulse width less than t

CYC

/2).

17. T

power up

: assumes a linear ramp from 0V to V

DD

(min.) within 200 ms. During this time V

IH

< V

DD

and V

DDQ

< V

DD

.

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