Dell Latitude LM - Manual (Page 4)

4 Dell Latitude LM Service Manual Update
A
dditional Parts and Assemblies
Removal and replacement procedures for all parts and assemblies are the same as
those described in Chapter 4, “Removing and Replacing Parts.” However, some
of the parts and assemblies used are different. The following information updates
Table 4-1, “Factory Repair Parts and Assemblies,” in Chapter 4.
CD-ROM Drive (continued)
Voltage . . . . . . . . . . . . . . . . . . 5 V (single-voltage drive)
Access time. . . . . . . . . . . . . . . 250 m/sec
Data transfer rate:
Sequential . . . . . . . . . . . . . 150 KB/sec
900 KB/sec (6X)
1500 KB/sec (10X)
From buffer. . . . . . . . . . . . 14.4 MB/sec
Physical:
Height . . . . . . . . . . . . . . . . 17.0 mm (0.67 inch)
Width . . . . . . . . . . . . . . . . 130.6 mm (5.14 inches)
Depth . . . . . . . . . . . . . . . . 140.6 mm (5.56 inches)
Weight (no CD in tray) . . . 0.35 kg (0.77 lb)
Factory Repair Parts and Assemblies
Part or Assembly Number Order Number
Board Assemblies
Board assembly, 166-MHz, service kit SVC,SYS,PLN,LMP166ST
Main board SYS,PLN,TFT,LMM
Processor board, 166-MHz CRD,PRCR,LMP166
Card, cache CRD,L2,CACHE,LMP
Heat sink, microprocessor,
subassembly SUBASSY,HTSNK,CPU,LMM
Screws, heat sink SCR,2X,4X4,PHH,MS,ZPS
Spacer/Bumper, rubber, flex cable BMPR,LCD,FPC,25X5X5M,LMP
Technical Specifications (continued)