Kontron COMe-bPC2 - Manual (Page 28)

COMe-bPC2 / Product Specification
3.11 Thermal Management
A heatspreader plate assembly is available from Kontron Europe GmbH for the COMe-bPC2. The heatspreader plate on top
of this assembly is NOT a heat sink. It works as a COM Express®-standard thermal interface to use with a heat sink or other
cooling device.
External cooling must be provided to maintain the heatspreader plate at proper operating temperatures. Under worst-
case conditions, the cooling mechanism must maintain an ambient air and heatspreader plate temperature of 60° C or
less.
The aluminum slugs and thermal pads on the underside of the heatspreader assembly implement thermal interfaces
between the heatspreader plate and the major heat-generating components on the COMe-bPC2. About 80 percent of the
power dissipated within the module is conducted to the heatspreader plate and can be removed by the cooling solution.
You can use many thermal-management solutions with the heatspreader plates, including active and passive approaches.
The optimum cooling solution varies, depending on the COM Express® application and environmental conditions. Please
see the COM Express® Design Guide for further information on thermal management.
3.12 Heatspreader
Documentation and CAD drawings of COMe-bPC2 heatspreader and cooling solutions is provided at
http://emdcustomersection.kontron.com .
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