Delta Electronics 10A - Manual (Page 15)

DS_DNM04SMD10_07162008
15
PICK AND PLACE LOCATION SURFACE-MOUNT TAPE & REEL
LEAD (Sn/Pb) PROCESS RECOMMEND TEMP. PROFILE
Time ( sec. )
Pre-heat temp.
140~180°C 60~120 sec.
Peak temp.
210~230°C 5sec.
Ramp-up temp.
0.5~3.0°C /sec.
Te
mper
atur
e (
°C )
50
100
150
200
250
300 60 0 120 180 240
2nd Ramp-up temp.
1.0~3.0°C /sec.
Over 200°C
40~50sec.
Cooling down rate <3°C /sec.
LEAD FREE (SAC) PROCESS RECOMMEND TEMP. PROFILE
Note: All temperature refers to assembly application board, measured on the land of assembly application board.
Temp .
Time
150℃
200℃
90~120 sec.
Time Limited 75 sec.
above 220℃
220℃
Preheat time
Ramp up
max. 3℃ /sec.
Ramp down
max. 4℃ /sec.
Peak Temp. 240 ~ 245 ℃
25℃