Epson Power Supply S1F70000 - Manual (Page 85)

S1F76640 Series
2–42 EPSON
S1F70000 Series
Technical Manual
Chip External Shape
Figure 4-4 Pad Assignments
(x) (y) (t)
Chip size : 2.30mm
×
2.60mm
×
0.30mm
PAD aperture : 100
µ
m
×
100
µ
m
DIE number : F76640D0A0
Pad Center Coordinates
S1F7664D0A0
Pad Pad Center Coordinates
No. Name X[
µ
m] Y[
µ
m]
1 RV –984.0 1096.0
2 V REG 788.0
3 (TESTOUT) 580.0
4 TC1 390.0
5 TC2 96.0
6 P OFF –218.0
7 GND –510.0
8 OSC1 –802.0
9 OSC2 –1094.0
10 V DD –1134.0
11 CAP1– –892.0
12 CAP1+ –514.0
13 CAP2– 182.0
14 CAP2+ 372.0
15 CAP3+ 750.0
16 V O 942.0
17 V RI 1134.0
+
(0,0)
Y
X
2.30mm
2.60mm
CHIP EXTERNAL SHAPE AND PAD CENTER COORDINATES
984.0