Recommended pad layout, Production considerations – Linx Technologies LICAL-DEC-HS001 User Manual

Page 16

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26

27

Receiver

Decoder

Create Key

Make Copy

Set Permissions

Transmitter

1

Encoder

1

Transmitter

2

Encoder

2

Transmitter

15

Encoder

15

Receiver

Decoder

Copy

Set Permissions

Receiver

Decoder

Copy

Set Permissions

Receiver

Decoder

Copy

Set Permissions

Expanded Access Points

Basic System

Figure 17: Expanding Access Points with the HS Series

Recommended Pad Layout

The HS Series encoders and decoders are implemented in an industry
standard 20-pin Shrink Small Outline Package (20-SSOP). The
recommended layout dimensions are shown in Figure 18.

Production Considerations

These surface-mount components are designed to comply with standard
reflow production methods. The recommended reflow profile is shown in
Figure 19 and should not be exceeded, as permanent damage to the part
may result.

0.047
(1.19)

0.016
(0.41)

0.026
(0.65)

0.328 (8.33)

0.234 (5.94)

Figure 18: PCB Layout Dimensions

240°C Max

0

25

50

75

100

125

150

175

200

225

250

TEMPERATURE (°C)

275

0

20

40

60

80

100

120

140

160

180

200

220

240

260

280

300

320

TIME (SECONDS)

340

360

380

420

400

260°C Max

Lead-Free
Sn / Pb

Figure 19: HS Series Reflow Profile

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