EPoX Computer KP6-FX2 - Manual (Page 8)

KP6-FX 2 1-2
1-1.1 S.E.C. Cartridge Overview
The entire enclosed product is called the Pentium ® II Processor. The packaging
technology and each of the physical elements of the product are referred to using
accurate technical descriptions. This allows clear reference to the products as just
a processor. This is the model used in past packaging technologies like PGA,
TCP, PQFP, DIP, etc.
1-1.2 S.E.C. Cartridge Terminology
• Pentium ® II Processor
The new enclosed card packaging technology is called a “Single Edge
Contact cartridge.” This is similar to previous names for packaging technol-
ogy such as PGA or TCP.
• Processor card
The green PCB (with or without components on it)
• Processor core
The silicon on the PLGA package on the PCB
• Cover
The plastic cover on the opposite side from the thermal plate.
• Slot 1
The slot that the S.E.C. cartridge plugs into, just as the Pentium® Pro
processor uses Socket 8.
• Retention mechanism
Formerly ‘retention module’ the dual posts, etc. that hold the cartridge in
place.
• Thermal plate
The heatsink attachment plate.
• Heat sink supports
The support pieces that are mounted on the mainboard to provide added
support for heatsinks.
The L2 cache (TagRAM, PBSRAM) components keep standard industry names.
The Pentium
® II Processor is the first product to utilize the S.E.C. cartridge
technology and Slot 1 connector. Unless otherwise noted, any references to
“Pentium
® II Processor,” “Pentium ® II Processor/Slot 1 processor” or Processor”
will apply to both the Pentium ® II Processor desktop processors.