Document Outline

• 1. General Description
  • 1.1 Applications
• 2. Features
• 3. Functional Block Diagram
  • 3.1 Interconnection
  • 3.2 Pin Descriptions
  • 3.3 Electrical Specifications
    • 3.3.1 Absolute Maximum ratings
    • 3.3.2 Recommended Operating Parameters
      • 3.3.2.1 Power Supply
      • 3.3.2.2 Signal Levels for Interface, PCM, SPI and GPIO
      • 3.3.2.3 RS-232 Interface
      • 3.3.2.4 SPI Bus
      • 3.3.2.5 PCM Interface
      • 3.3.2.6 General Purpose I/O and ADC
      • 3.3.2.7 Miscellaneous
• 4. I/O Characteristics
  • 4.1 Power Consumption
    • 4.1.1 Typical Current Consumption in mA
• 5. RF Performance
  • 5.1.1 Transmit Power
    • 5.1.2 Receive Sensitivity
• 6. Functional Description
  • 6.1 Interfaces
    • 6.1.1 UART interface
    • 6.1.2 SPI bus
    • 6.1.3 GPIO Port
    • 6.1.4 PCM CODEC Interface
      • 6.1.4.1 Compatible Codec Chips
      • 6.1.4.2 Audio Codec Development Boards
    • 6.1.5 ADC
• 7. Integrated Firmware
  • 7.1 General
  • 7.2 Profiles
  • 7.3 AT Overview
    • 7.3.1 AT features at a glance
      • 7.3.1.1 General
      • 7.3.1.2 Audio
      • 7.3.1.3 UART
      • 7.3.1.4 Security
      • 7.3.1.5 Bluetooth
      • 7.3.1.6 Power Management
  • 7.4 Multipoint Firmware
  • 7.5 OTA (Over the Air) Configuration
  • 7.6 Boot modes
• 8. Low Power Modes
  • 8.1 Low Power Modes using Sniff
• 9. Application Examples
  • 9.1 RS232 Modem Signals
  • 9.2 Modem signalling over Bluetooth
  • 9.3 Pure Cable Replacement Mode
  • 9.4 Audio Cable (voice)
  • 9.5 Oscillator Output
• 10. Application Information
  • 10.1 Antenna Position
  • 10.2 Power Supply Considerations
  • 10.3 Power-On-Reset (Power Cycling and Brown Out considerations)
  • 10.4 RF Shield
  • 10.5 Mounting the Module onto the application platform
    • 10.5.1 Fixing Pillars
• 11. Board to Board Connector
  • 11.1 Stacking Height
  • 11.2 Hirose Connector general specification
• 12. Qualification
  • 12.1 Qualification Process
  • 12.2 Safety Information:
  • 12.3 Certifications
    • 12.3.1 Bluetooth Qualification
      • 12.3.1.1 FCC Labelling requirement
    • 12.3.2 National RF approvals
      • 12.3.2.1 R&TTE Notification Requirement
• 13. Environmental
  • 13.1 Operating temperatures
  • 13.2 Storage temperature
  • 13.3 Reliability
• 14. Physical Dimensions
  • 14.1 Mechanical Dimensions
    • 14.1.1 Standard Module
  • 14.2 BISM II PA Module without antenna (special order)
  • 14.3 Labelling
  • 14.4 Ordering Information
• 15. Related Documents
• 16. Development Kit
• 17. Interchangeable 802.11 Module
• 18. Disclaimers
  • 18.1 Data Sheet Status – Preliminary Engineering Release
  • 18.2 Warranty