Amplifier setup, Forward path alignment, Before you begin – Motorola BLE*/* User Manual

Page 22

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BLE*/* Installation and Operation Manual

Section 3

Amplifier Setup

This section provides instructions for fully configuring the BLE*/* and describes the proper
forward and return path alignment procedures. It is recommended that you read this entire
section before you install the BLE*/*.

To successfully setup the BLE*/* you need to perform the following tasks:

ƒ

Forward path alignment

ƒ

Return path alignment

ƒ

Check powering and surge protection options

Forward Path Alignment

You must perform the following BLE*/* alignment procedures for proper performance in the
forward path:

ƒ

Select the appropriate cable equalizer or cable simulator

ƒ

Select the appropriate input and midstage pads

ƒ

Verify proper flatness control

ƒ

Verify proper level control

Before You Begin

Before you begin to set-up the amplifier and perform forward-path alignment, please read the
following instructions and recommendations.

For proper forward alignment obtain:

ƒ

RF output levels and tilts of all BLE*/*s in the forward or return path

ƒ

RF input level for the BLE*/* being set up (from system design or as-built map)

ƒ

A carrier at the system’s highest frequency. It can be modulated or continuous wave (CW)

and should be inserted in the headend at standard video levels. This carrier is used to
simplify field set-up.

It is recommended that you:

ƒ

Install the system design value SFE-*-* and a high value (20 dB or above) input pad (

JXP

IN

)

before you install or remove the electronics chassis or apply power to the BLE*/*.

Leave the

JXP IN

pad location open if a high value pad is not available. A more accurate

forward input test point reading is achieved with a high value pad installed.

ƒ

Do not use wire jumpers to bypass the SFE-*-* location.

ƒ

Recognize that actual pad and SFE-*-* values may differ slightly from their design values.

This is caused by factors such as walkout errors, worst-case data utilization during design
and temperature variation from 70

°F.

ƒ

Secure the electronics chassis in the housing base and torque to 18-22 in-lbs. to facilitate

heat transfer and avoid damage from overheating.

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