Symbol Technologies CMOS CXP854P60 - Manual (Page 20)

– 20 –
CXP854P60
Package Outline Unit: mm
64PIN SDIP (PLASTIC)
MI
N
0.
5
MI
N
3.
0
4.
75 – 0.
1
0.9 ± 0.15
0.5 ± 0.1
0.
25 – 0.
05
+ 0.
1
17.
1
– 0.
1
19.
0
5
1 32
33 64
1.778
57.6 – 0.1
+ 0.4
PACKAGE MATERIAL
LEAD TREATMENT
LEAD MATERIAL
PACKAGE MASS
EPOXY RESIN
42/COPPER ALLOY
SONY CODE
EIAJ CODE
JEDEC CODE
SDIP-64P-01
P-SDIP64-17.1x57.6-1.778
SOLDER PLATING
8.6g
+ 0.
3
+ 0.
3
0˚ to 15˚
PACKAGE STRUCTURE
64PIN SDIP (PLASTIC)
MI
N
0.
5
MI
N
3.
0
4.
75
–
0.
1
0.9 ± 0.15
0.5 ± 0.1
0.
25
–
0.
05
+ 0.
1
17.
1
–
0.
1
19.
0
5
1 32
33 64
1.778
57.6 – 0.1
+ 0.4
PACKAGE MATERIAL
LEAD TREATMENT
LEAD MATERIAL
PACKAGE MASS
EPOXY RESIN
42/COPPER ALLOY
SONY CODE
EIAJ CODE
JEDEC CODE
SDIP-64P-01
P-SDIP64-17.1x57.6-1.778
SOLDER PLATING
8.6g
+ 0.
3
+ 0.
3
0˚ to 15˚
PACKAGE STRUCTURE
LEAD SPECIFICATIONS
ITEM
LEAD MATERIAL ALLOY 42
LEAD TREATMENT Sn-Bi 2.5%
LEAD TREATMENT THICKNESS 5-18 µ m
SPEC.