2 chipset overview – SUPER MICRO Computer X7DVL-3 User Manual

Page 15

Advertising
background image

Chapter 1: Introduction

1-9

1-2 Chipset

Overview

Built upon the functionality and the capability of the 5000V chipset, the X7DVL-3/

X7DVL-i motherboard provides the performance and feature set required for dual

processor-based servers with confi guration options optimized for communications,

presentation, storage, computation or database applications. The 5000V chipset

supports a single or dual Intel Xeon 64-bit Quad Core/Dual Core processor(s)

with front side bus speeds of up to 1.333 GHz. The chipset consists of the 5000V

Memory Controller Hub (MCH), and the Enterprise South Bridge 2 (ESB2).

The 5000V MCH chipset is designed for symmetric multiprocessing across two

independent front side bus interfaces. Each front side bus uses a 64-bit wide, 1333

MHz data bus that transfers data at 10.7 GB/sec. The MCH chipset connects up

to six Fully Buffered DIMM modules, providing a total memory size of up to 16 GB.

The MCH chipset also provides one x8 PCI-Express interface to the ESB2. In ad-

dition, the 5000V chipset offers a wide range of RAS features, including memory

interface ECC, x4/x8 Single Device Data Correction, CRC, parity protection, memory

mirroring and memory sparing.

The Xeon Quad Core/Dual Core Processor Features

Designed to be used with conjunction of the 5000V chipset, the Xeon Quad Core/

Dual Core Processor provides a feature set as follows:

The Xeon Dual Core Processors

*L1 Cache Size: Instruction Cache (32KB/16KB), Data Cache (32KB/24KB)

*L2 Cache Size: 4MB/2MB (per core)

*Data Bus Transfer Rate: 8.5 GB/s

*Package: FC-LGA6/FC-LGA4, 771 Lands

Advertising