Renesas Pod Probe for 7906 Group MCUs M37906T-PRB - Manual (Page 6)

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Contents
Chapter 1. Precautions for Safety ........................................................................................... 7
1.1 Safety Symbols and Meanings .............................................................................. 8
Warning for Installation ................................................................................... 9
Warning for Use Environment ......................................................................... 9
Caution to Be Taken for Modifying This Product ........................................... 9
Cautions to Be Taken for This Product ........................................................... 9
Notes on Target System ................................................................................. 10
Note on Reset Input from the Target System ................................................ 10
Notes on Stack Area ...................................................................................... 10
Note on MCU Files ........................................................................................ 10
Notes on EMEM Dialog ................................................................................ 11
Note on Boot Mode ........................................................................................ 11
Note on Breaks Used with Internal Resources .............................................. 11
Note on Debug Monitor Area ........................................................................ 11
Note on Interface with the Target System ..................................................... 12
Notes on Service-Life of the MCU's Internal Flash ROM ............................ 12
Note on Debug Commands during STP/WIT Instruction ............................. 12
Notes on Disabling Watchdog Function ........................................................ 12
Note on Real-Time RAM Monitor ................................................................ 12
Note on Coverage Measurement .................................................................... 12
Note on Differences between Actual MCU and Emulator ............................ 13
Chapter 2. Preparation .......................................................................................................... 15
2.1 Terminology ........................................................................................................ 16
2.2 Package Components .......................................................................................... 17
2.3 Other Tool Products Required for Development ................................................ 17
2.4 System Configuration .......................................................................................... 18
Chapter 3. Setting Up ........................................................................................................... 19
3.1 Switch Settings .................................................................................................... 20
3.2 A-D Conversion Bypass Capacitor ..................................................................... 21
3.3 Connecting the Emulation Pod Main Unit .......................................................... 22
3.4 Connecting the Target System ............................................................................ 24