Oki BISM2 - Manual (Page 25)

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11. Board to Board Connector
This chapter provides specifications for the 40-pin board-to-board connector which serves as physical
interface to the host application. The receptacle assembled on the Module is Hirose type DF12C.
Details are available at: http://www.hirose.co.jp/cataloge_hp/e53700036.pdf
11.1 Stacking Height
Mating headers from Hirose are available in different stacking heights, allowing the spacing between
the BISM2 and carrier pcb to be changed from 3.5mm to 5.0mm.
Notes: The headers listed above are with boss and metal fitting.
Suffix -86 denotes RoHS compliance.
11.2 Hirose Connector general specification
Parameter Specification (40 pin Board to Board connector)
Number of Contacts 40
Quantity delivered 2000 Connectors per Tape & Reel
Voltage 50V
Current Rating 0.5A max per contact
Resistance 0.05 Ohm per contact
Dielectric Withstanding Voltage 500V RMS min
Operating Temperature -45°C...+125°C
Contact Material phosphor bronze (surface: gold plated)
Item Part number Stacking height HRS number
Receptacle on
Module DF12C-40DS-0.5V(86) 3.5 mm – 5 mm CL537-0007-7-86
Headers DF12 series DF12(3.5)-40DP-0.5V(86) 3.5 mm CL537-0032-4-86
DF12(4.0)-40DP-0.5V(86) 4.0 mm CL537-0057-5-86
DF12(5.0)-40DP-0.5V(86) 5.0 mm CL537-0157-0-86