Toshiba Semiconductor - Manual (Page 20)

[6] Handling Guide
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3.5.3 Soldering Temperature Profile
The soldering temperature and heating time vary from device to device. Therefore, when specifying
the mounting conditions, refer to the individual datasheets and databooks for the devices used.
(1) Using a soldering iron
Complete soldering within ten seconds for lead temperatures of up to 260°C, or within three
seconds for lead temperatures of up to 350°C.
(2) Using medium infrared ray reflow
• Heating top and bottom with long or medium infrared rays is recommended(see Figure3.10).
Figure 3.10 Heating Top and Bottom with Long or Medium Infrared Rays
• Complete the infrared ray reflow process within 30 seconds at a package surface
temperature of between 210°C and 240°C.
• Refer to Figure 3.11 for an example of a good temperature profile for infrared or hot air
reflow.
Figure 3.11 Sample Temperature Profile for Infrared or Hot Air Reflow
(3) Using hot air reflow
• Complete hot air reflow within 30 seconds at a package surface temperature of between
210°C and 240°C
• For an example of a recommended temperature profile, refer to Figure 3.11 above.
Medium infrared ray heater
(reflow)
Long infrared ray heater (preheating)
Product flow
210
30
seconds
or less
Time (in seconds)
60-120
seconds
(°C)
240
160
140 P
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