Toshiba Semiconductor - Manual (Page 22)

[6] Handling Guide
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3.5.5 No Cleaning
If analog devices or high-speed devices are used without being cleaned, flux residues may cause
minute amounts of leakage between pins. Similarly, dew condensation, which occurs in environments
containing residual chlorine when power to the device is on, may cause between-lead leakage or
migration. Therefore, Toshiba recommends that these devices be cleaned.
However, if the flux used contains only a small amount of halogen (0.05 W% or less), the devices may
be used without cleaning without any problems.
3.5.6 Circuit Board Coating
When devices are to be used in equipment requiring a high degree of reliability or in extreme
environments (where moisture, corrosive gas or dust is present), circuit boards may be coated for
protection. However, before doing so, you must carefully consider the possible stress and
contamination effects that may result and then choose the coating resin which results in the
minimum level of stress to the device.