Toshiba Semiconductor - Manual (Page 7)

[6] Handling Guide
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3.2 Storage
3.2.1 General Storage
• Avoid storage locations where devices will be exposed to moisture or direct sunlight
• Follow the instructions printed on the device cartons regarding
transportation and storage.
• The storage area temperature should be kept within a
temperature range of 5°C to 35°C, and relative humidity
should be maintained at between 45% and 75%.
• Do not store devices in the presence of harmful (especially
corrosive) gases, or in dusty conditions.
• Use storage areas where there is minimal temperature
fluctuation. Rapid temperature changes can cause moisture to form on stored devices, resulting
in lead oxidation or corrosion. As a result, the solderability of the leads will be degraded.
• When repacking devices, use anti-static containers.
• Do not allow external forces or loads to be applied to devices while they are in storage.
• If devices have been stored for more than two years, their electrical characteristics should be
tested and their leads should be tested for ease of soldering before they are used.
Humidity:
Temperature: