Texas Instruments 3138 155 232931 - Manual (Page 84)

CC2420
SWRS041B Page 84 of 89
40 Recommended layout for package (QLP 48)
Note: The figure is an illustration only and not to scale. There are nine 14 mil diameter via
holes distributed symmetrically in the ground pad under the package. See also the CC2420
EM reference design.
40.1 Package thermal properties
Thermal resistance
Air velocity [m/s] 0
Rth,j-a [K/W] 25.6
40.2 Soldering information
Recommended soldering profile is according to IPC/JEDEC J-STD-020C.