Vishay semiconductors – C&H Technology VS-GB100TH120U User Manual

Page 2

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VS-GB100TH120U

www.vishay.com

Vishay Semiconductors

Revision: 20-Sep-12

1

Document Number: 93413

For technical questions within your region:

[email protected]

,

[email protected]

,

[email protected]

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT

www.vishay.com/doc?91000

Molding Type Module IGBT,

2 in 1 Package, 1200 V and 100 A

FEATURES

• NPT IGBT technology

• 10 μs short circuit capability

• Low switching losses

• Rugged with ultrafast performance

• V

CE(on)

with positive temperature coefficient

• Low inductance case

• Fast and soft reverse recovery antiparallel FWD

• Isolated copper baseplate using DCB (Direct Copper

Bonding) technology

• Material categorization: For definitions of compliance

please see

www.vishay.com/doc?99912

TYPICAL APPLICATIONS

• Switching mode power supplies
• Inductive heating
• Electronic welder

DESCRIPTION

Vishay’s IGBT power module provides ultrafast switching
speed as well as short circuit ruggedness. It is designed for
applications such as electronic welders and inductive
heating.

Note

(1)

Repetitive rating: Pulse width limited by maximum junction temperature.

PRODUCT SUMMARY

V

CES

1200 V

I

C

at T

C

= 80 °C

100 A

V

CE(on)

(typical)

at I

C

= 100 A, 25 °C

3.10 V

Double INT-A-PAK

ABSOLUTE MAXIMUM RATINGS (T

C

= 25 °C unless otherwise noted)

PARAMETER

SYMBOL

TEST CONDITIONS

MAX.

UNITS

Collector to emitter voltage

V

CES

1200

V

Gate to emitter voltage

V

GES

± 20

Collector current

I

C

T

C

= 25 °C

200

A

T

C

= 80 °C

100

Pulsed collector current

I

CM

(1)

t

p

= 1 ms

200

Diode continuous forward current

I

F

100

Diode maximum forward current

I

FM

(1)

200

Maximum power dissipation

P

D

T

J

= 150 °C

1136

W

Isolation voltage

V

ISOL

f = 50 Hz, t = 1 min

2500

V

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