Vishay semiconductors, Thermal and mechanical specifications – C&H Technology VS-GB90DA120U User Manual

Page 4

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VS-GB90DA120U

www.vishay.com

Vishay Semiconductors

Revision: 02-Aug-12

3

Document Number: 94722

For technical questions within your region:

[email protected]

,

[email protected]

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THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT

www.vishay.com/doc?91000

Fig. 1 - Maximum DC IGBT Collector Current vs.

Case Temperature

Fig. 2 - Typical Collector to Emitter Current

Output Characteristics of IGBT

Fig. 3 - Allowable Forward Current vs. Case Temperature

Diode Leg

Fig. 4 - Typical Diode Forward Voltage Drop Characteristics

THERMAL AND MECHANICAL SPECIFICATIONS

PARAMETER

SYMBOL

MIN. TYP. MAX.

UNITS

Maximum junction and storage temperature range

T

J

, T

Stg

- 40

-

150

°C

Junction to case thermal resistance

IGBT

R

thJC

-

-

0.145

°C/W

Diode

-

-

0.35

Case to sink thermal resistance, flat, greased surface

R

thCS

-

0.05

-

Mounting torque, on terminals and heatsink

-

-

1.3

Nm

Weight

-

30

-

g

Case style

SOT-227

I

C

-

Continuous Collector Current (A)

Allowable Case Temperature (°C)

80

100

120

140

160

0

20

40

60

0 20 40 60 80 100 120 140 160

DC

V

CE

-

Collector-to-Emitter Voltage (V)

I

C

-

Collector

-to-Emitter Curr

ent (A)

100

150

200

0

50

0.0 1.0 2.0 3.0 4.0 5.0 6.0 7.0

T

J

= 25 °C

T

J

= 125 °C

T

J

= 150 °C

V

GE

= 15 V

I

F

-

Continuous

Forward Current (A)

Allowable

Case

Temperature

(°C)

80

100

120

140

160

0

20

40

60

0 20 40 60 80 100

V

FM

-

Forward Voltage Drop (V)

I

F

- Forwar

d

Curr

ent (A)

80

120

160

0

40

0.0 1.0 2.0 3.0 4.0 5.0

T

J

= 125 °C

T

J

= 150 °C

T

J

= 25 °C

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