Vishay semiconductors, Thermal and mechanical specifications – C&H Technology VS-GB50TP120N User Manual
Page 4
VS-GB50TP120N
www.vishay.com
Vishay Semiconductors
Revision: 17-May-13
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Document Number: 94820
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Fig. 1 - Typical Output Characteristics
Fig. 2 - Typical Transfer Characteristics
Fig. 3 - Switching Loss vs. I
C
Fig. 4 - Switching Loss vs. R
g
THERMAL AND MECHANICAL SPECIFICATIONS
PARAMETER
SYMBOL
TEST CONDITIONS
MIN.
TYP.
MAX.
UNITS
Operating junction temperature
T
J
-
-
150
°C
Storage temperature range
T
STG
- 40
-
125
Junction to case
IGBT (per 1/2 module)
R
thJC
-
-
0.28
K/W
Diode (per 1/2 module)
-
-
0.49
Case to sink
R
thCS
Conductive grease applied
-
0.05
-
Mounting torque
Power terminal screw: M5
2.5 to 5.0
Nm
Mounting screw: M6
3.0 to 5.0
Weight of module
150
g
100
90
80
70
60
50
40
30
20
10
0
0
0.5
1.5
1
2
2.5
3
V
CE
(V)
I
C
(A)
V
GE
= 15 V
25 °C
125 °C
100
90
80
70
60
50
40
30
20
10
0
6
7
9
8
10
11
12
V
GE
(V)
I
C
(A)
V
CE
= 20 V
25 °C
125 °C
0
5
10
15
20
25
0
20
40
60
80
100
I
C
(A)
E
on
, E
of
f
(mJ)
V
GE
= ± 15 V
T
J
=
125 °C
R
g
= 15
Ω
V
CC
= 600 V
E
on
E
off
0
5
10
15
20
25
0
20
40
60
80
100
R
g
(
Ω)
E
on
, E
of
f
(mJ)
V
GE
= ± 15 V
T
J
=
125 °C
I
C
= 50 A
V
CC
= 600 V
E
on
E
off