Vishay semiconductors – C&H Technology VS-GT175DA120U User Manual

Page 6

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VS-GT175DA120U

www.vishay.com

Vishay Semiconductors

Revision: 02-Aug-12

5

Document Number: 93990

For technical questions within your region:

[email protected]

,

[email protected]

,

[email protected]

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT

www.vishay.com/doc?91000

Fig. 11 - Typical IGBT Energy Loss vs. R

g

T

J

= 125 °C, I

C

= 75 A, L = 500 μH, V

CC

= 600 V, V

GE

= 15 V

Diode used: HFA16PB120

Fig. 12 - Typical IGBT Switching Time vs. R

g

T

J

= 125 °C, L = 500 μH, V

CC

= 600 V, I

C

= 75 A, V

GE

= 15 V

Diode used: HFA16PB120

Fig. 13 - Typical Reverse Recovery Time vs. dI

F

/dt, of Diode,

at I

F

= 50 A, V

R

= 400 V

Fig. 14 - Typical Stored Charge vs. dI

F

/dt of Diode,

at I

F

= 50 A, V

R

= 400 V

Fig. 15 - Typical Reverse Recovery Current vs. dI

F

/dt, of Diode,

at I

F

= 50 A, V

R

= 400 V

R

g

(

Ω)

Energy Losses (mJ)

20

30

40

0

10

0 10 20 30 40 50

E

on

E

off

S

witching Time (μs)

R

g

(

Ω)

0.1

1

10

0.01

0 10 20 30 40 50 60

t

d(on)

t

d(off)

t

r

t

f

t

rr

(ns)

dI

F

/dt (A/μs)

100

1000

90

310

150

190

270

130

110

170

230

290

250

210

T

J

= 125 °C

T

J

= 25 °C

Q

rr

(nC)

dI

F

/dt (A/μs)

100

1000

0

3000

1000

1500

2500

2000

500

T

J

= 125 °C

T

J

= 25 °C

I

rr

(A)

dI

F

/dt (A/μs)

100

1000

0

45

25

35

40

20

30

10

15

5

T

J

= 25 °C

T

J

= 125 °C

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