C-compatible rtc in a tdfn max6900, Package information (continued) – Rainbow Electronics MAX6900 User Manual
Page 17
I
2
C-Compatible RTC in a TDFN
MAX6900
Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are
implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.
Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600 ____________________ 17
© 2003 Maxim Integrated Products
Printed USA
is a registered trademark of Maxim Integrated Products.
DOCUMENT CONTROL NO.
APPROVAL
TITLE:
PROPRIETARY INFORMATION
REV.
2
2
COMMON DIMENSIONS
SYMBOL
MIN.
MAX.
A
0.70
0.80
D
2.90
3.10
E
2.90
3.10
A1
0.00
0.05
L
0.20
0.40
PKG. CODE
6
N
T633-1
1.50–0.10
D2
2.30–0.10
E2
0.95 BSC
e
MO229 / WEEA
JEDEC SPEC
0.40–0.05
b
1.90 REF
[(N/2)-1] x e
1.50–0.10
MO229 / WEEC
1.95 REF
0.30–0.05
0.65 BSC
2.30–0.10
T833-1
8
PACKAGE VARIATIONS
21-0137
0.25–0.05
2.00 REF
MO229 / WEED-3
0.50 BSC
1.50–0.10
2.30–0.10
10
T1033-1
0.25 MIN.
k
A2
0.20 REF.
D
SEMICONDUCTOR
DALLAS
PACKAGE OUTLINE, 6, 8 & 10L,
TDFN, EXPOSED PAD, 3x3x0.80 mm
Package Information (continued)
(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information