Rainbow Electronics MAX6622 - Manual (Page 2)

MAX6622
5-Channel Precision Temperature Monitor
2 _______________________________________________________________________________________
ABSOLUTE MAXIMUM RATINGS
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
V
CC
, SMBCLK, SMBDATA, ALERT, OVERT,
STBY to GND .......................................................-0.3V to +6V
DXP_ to GND..............................................-0.3V to (V
CC
+ 0.3V)
DXN2, DXN3, DXN4 to GND .................................-0.3V to +0.8V
SMBDATA,
ALERT, OVERT Current....................-1mA to +50mA
DXN Current .......................................................................±1mA
Continuous Power Dissipation (T
A = +70°C)
16-Pin TSSOP
(derate 11.1mW/°C above +70°C)..............................888.9mW
Junction-to-Case Thermal Resistance (
θ
JC
) (Note A)
16-Pin TSSOP ..............................................................27°C/W
Junction-to-Ambient Thermal Resistance ( θ
JA
) (Note A)
16-Pin TSSOP...............................................................90°C/W
ESD Protection (all pins, Human Body Model) ................±2000V
Operating Temperature Range .........................-40°C to +125°C
Junction Temperature ......................................................+150°C
Storage Temperature Range .............................-60°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
ELECTRICAL CHARACTERISTICS
(V
CC
= +3.0V to +5.5V, V STBY = V
CC
, T
A
= -40°C to +125°C, unless otherwise noted. Typical values are at V
CC
= +3.3V and
T
A
= +25°C.) (Note 1)
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
Supply Voltage V CC 3.0 5.5 V
Software Standby Supply Current I SS SMBus static 30 µA
Operating Current I CC During conversion 500 1000 µA
Channel 1 only 11
Temperature Resolution
Other diode channels 8
Bits
T A = T RJ = +60°C to +100°C -1.0 +1.0
Remote Temperature Accuracy V CC = 3.3V
T A = T RJ = 0°C to +125°C -3.0 +3.0
o C
T A = +60°C to +100°C -4.4 -0.4
Local Temperature Accuracy V CC = 3.3V
T A = 0°C to +125°C -6.1 -0.1
o C
Supply Sensitivity of Temperature
Accuracy
±0.2 o C/V
Resistance cancellation off 95 125 156 Remote Channel 1 Conversion
Time
t CONV1
Resistance cancellation on 190 250 312
ms
Remote Channels 2 Through 4
Conversion Time
t CONV_ 95 125 156 ms
High level 80 100 120
Remote-Diode Source Current I RJ
Low level 8 10 12
µA
Undervoltage-Lockout Threshold UVLO Falling edge of V CC disables ADC 2.30 2.80 2.95 V
Undervoltage-Lockout Hysteresis 90 mV
Power-On-Reset (POR) Threshold V CC falling edge 1.2 2.0 2.5 V
POR Threshold Hysteresis 90 mV
ALERT, OVERT
I SINK = 1mA 0.3
Output Low Voltage V
OL
I SINK = 6mA 0.5
V
Output Leakage Current 1 µA
Note A: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a
4-layer board. For detailed information on package thermal considerations, refer to Application Note 4083 available
at www.maxim-ic.com/thermal-tutorial.