Rainbow Electronics TS81102G0 - Manual (Page 26)

26
TS81102G0
2105C–BDC–11/03
Outline
Dimensions
Figure 21. Package Dimension – 240 Tape Ball Grid Array
Thermal and Moisture
Characteristics
Thermal Resistance
from Junction to
Case: RTHJC The Rth from junction to case for the TBGA package is estimated at 1.05 ° C/W that can be bro-
ken down as follows:
• Silicon: 0.1 ° C/W
• Die attach epoxy: 0.5
°
C/W (thickness # 50 µm)
• Copper block (back side of the package): 0.1
°
C/W
• Black Ink: 0.251 ° C/W.
D
D1
- A -
- B -
0.10
Corner
Top View
Side View
Bottom View
45 degree
0.5 mm chamfer
(4 PLCS)
E E1
e
g
Detail B
Detail B
Notes: 1. All dimensions are in millimeters.
2. "e" represents the basic solder ball grid pitch.
3. "M" represents the basic solder ball matrix size,
and symbol "N" is the maximum allowable number
of balls after depopulating.
7. Package surface shall be black oxide.
8. Cavity depth various with die thickness.
9. Substrate material base is copper.
Detail A
Detail A
11
6
10 Bilateral tolerance zone is applied to each side of
package
body.
11 45 deg. 0.5 mm chamfer corner and white dot for
pin 1 identification.
4
5
10
- C -
0.30
0.30
C
A C B
e
1
A
C
E
G
J
L
N
R
W
U
B
D
F
H
K
M
P
T
V
3 5 7 9 11 13 15 17 19
2 4 6 8 10 12 14 16 18
g
b
M M M
M
ccc C
C
P
A1
A
4 "b" is measured at the maximum solder ball diameter
parallel to primary datum - C -
5 Dimension "aaa" is measured parallel to primary
datum - C -
6 Primary datum - C - and seatin plane are defined by
the spherical crowns of the solder balls.
aaa C
A
Ref.
Dimensional References
A1
D
D1
E
E1
b
c
M
N
aaa
ccc
e
g
P
1.30
Min.
0.50
24.80
24.80
0.60
0.80
-
-
0.35
0.15
1.50
Nom.
0.60
25.00
22.86 (BSC.)
25.00
22.86 (BSC.)
0.75
0.90
19.00
240.00
-
- -
-
-
- -
-
1.27 TYP.
1.70
Max.
0.70
25.20
25.20
0.90
1.00
0.15
0.25